Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
Verified Supplier
2 Years
guangdong, foshan
Since 2018
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Panel Level Packaging Form
Panel Level Packaging Chip
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Panel Level Packaging Form

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Panel Level Packaging Chip

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Panel Level Packaging Product Structure

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Fan Out Panel Level Packaging

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TGV Through Glass Via

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Packaging Simulation Experiments

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310*320mm Panel Size Panel Level QFN Low Electrical Resistance
Panel Level Packaging Form

310*320mm Panel Size Panel Level QFN Low Electrical Resistance
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0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter
Panel Level Packaging Form

0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter
Brand Name：FZX Fanout Process and Product
Place of Origin：PR China
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Panel Level Packaging Panel Level SiP Used In Various Industries
Panel Level Packaging Form

Panel Level Packaging Panel Level SiP Used In Various Industries
Model：SiP
Brand Name：FZX Fanout Process and Product
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310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption
Panel Level Packaging Chip

310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption
Model：Multi-chip MOSFET
MOQ：3000pcs
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LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm
Panel Level Packaging Chip

LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm
Model：LED chip（Silicon）
MOQ：3000pcs
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310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）
Panel Level Packaging Chip

310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）
Model：Resistance chip
MOQ：3000pcs
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310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip（Silicon）
Panel Level Packaging Chip

310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip（Silicon）
Model：FZX-IC Chip
MOQ：3000pcs
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Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability
Panel Level Packaging Product Structure

Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability
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Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump
Panel Level Packaging Product Structure

Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump
Model：Face up-wafer bump
MOQ：3000pcs
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Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball
Panel Level Packaging Product Structure

Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball
Model：Face up-wire bond ball
MOQ：3000pcs
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Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package
Panel Level Packaging Product Structure

Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package
Model：embedded package
MOQ：3000pcs
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310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product
Fan Out Panel Level Packaging

310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product
Model：FZX-GaN
MOQ：3000pcs
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310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)
Fan Out Panel Level Packaging

310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)
Model：Radio Frequency (RF)
MOQ：3000pcs
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310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package
Fan Out Panel Level Packaging

310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package
Model：MEMS
MOQ：3000pcs
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310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED
Fan Out Panel Level Packaging

310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED
Model：FZX-CPO/mini/micro LED
MOQ：3000pcs
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310*320mm Fan-Out Panel Level Packaging (FOPLP) Power Package
Fan Out Panel Level Packaging

310*320mm Fan-Out Panel Level Packaging (FOPLP) Power Package
Model：FZX- power package
MOQ：3000pcs
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high aspect ratio TGV Foundary Capabilities for semiconductor packaging
TGV Through Glass Via

high aspect ratio TGV Foundary Capabilities for semiconductor packaging
Model：TGV Foundary
MOQ：10 panel
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High Efficiency Though Hole/Blind Hole On Glass 35um For GPU/CPU/AI Chips
TGV Through Glass Via

High Efficiency Though Hole/Blind Hole On Glass 35um For GPU/CPU/AI Chips
Model：FZX-TH2
MOQ：10 panel
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High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm
TGV Through Glass Via

High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm
Model：FZX-PVD2
MOQ：10 panel
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Glass Substrate Technology-Plating Double Side Stable And Easily Maintain
TGV Through Glass Via

Glass Substrate Technology-Plating Double Side Stable And Easily Maintain
Model：FZX
MOQ：10 panel
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