High Density 12Pin SMT Male Female PCB Connector 0.5 0.8mm Pitch Stack Height 6.0mm Board to Board & Mezzanine Connectors

Product Highlights

✅ Blind‑Mating & Self‑Alignment Tolerance Design: Built‑in guiding posts absorb PCB assembly offset, avoid pin damage during blind mating, improves production yield for automated SMT lines.

✅ High‑Speed Signal Integrity: Optimized contact impedance, stable transmission for high‑speed differential signals, fits high‑speed signal path layout requirements.

✅ Fixed Mated Stack Height 6.0 mm: Precisely controlled PCB‑to‑PCB gap, consistent mezzanine spacing for parallel stacked‑board mechanical design.

✅ High‑Density SMT Layout: Dual‑row compact footprint, saves PCB real estate for space‑constrained module designs.

✅ SMT‑Friendly Construction: Pick‑and‑place compatible housing, supports reflow soldering, AOI inspection accessible after assembly.

Product Description

Cross‑Reference / Alternative

Direct second‑source replacement for mainstream board‑to‑board mezzanine connector series from Molex, JAE, and TE Connectivity equivalents with 0.5 / 0.8 mm pitch, 6.0 mm mated height.

Footprint‑compatible for most reference designs; verify pad layout before PCB finalization. Eliminates long lead‑time risks of overseas original components, keeps identical electrical & mechanical performance.

Product Feature

1. Anti‑mis‑mating polarization structure prevents reverse insertion damage during manual & automatic assembly.
2. Self‑alignment floating tolerance absorbs stack‑up & assembly offset error, reduces connector scrap rate.
3. Dual‑point contact structure maintains stable contact force under vibration & thermal cycling conditions
4. High‑temp LCP housing sustains standard SMT reflow profile without deformation.
5. Compact high‑density 12‑pin configuration balances I/O quantity and PCB footprint.
6. Male‑female matched set, dedicated for parallel PCB‑to‑PCB mezzanine stacking connections.