620 Pyrophosphate Copper Plating Process
Performance & Features
- Cyanide-free, low toxicity; weakly alkaline bath with no corrosion to steel substrates.
- High coating gloss, delivering perfect mirror-bright finish on workpieces.
- Excellent leveling and ductility of deposits.
- Current efficiency close to 100% with outstanding adhesion.
Operating Parameters
| Item |
Concentration & Range |
| Copper Pyrophosphate |
75–95 g/L |
| Potassium Pyrophosphate |
280–350 g/L |
| Ammonia Water |
1–3 mL/L |
| 620 Brightener |
0.4–1 mL/L |
| pH Value |
8.5–8.9 |
| P Ratio (Total Pyrophosphate / Copper Metal) |
6.6–7.3 |
| Operating Temperature |
55–60 ℃ |
| Anode Current Density |
1–3.5 A/dm² |
| Cathode Current Density |
1–6 A/dm² |
| Agitation Mode |
Air agitation |
| Anode Material |
Electrolytic Copper Plate |
| Anode Bag |
Not required |