DS-111 Pyrophosphate Copper Pre-Plating Process
Performance & Features
The coating boasts strong adhesion to substrates. It can be used for direct plating or strike plating on steel, and delivers excellent coatings on aluminum alloy and zinc alloy.
- Serves as an underlayer for acid copper, nickel, tin, silver and gold plating.
- Outstanding comprehensive performance including superior throwing power, high current efficiency, pore-free and compact deposits.
- Simple bath composition, easy maintenance and stable solution.
- Eco-friendly, safe operation and simple wastewater treatment.
- Compatible with cyanide alkaline copper baths for direct tank conversion.
Operating Parameters
| Item |
Working Range (Rack Plating) |
| Copper Pyrophosphate |
20–40 g/L |
| DS111 Complexing Agent |
160–200 g/L |
| Potassium Sodium Tartrate |
25–30 g/L |
| Alkaline Copper Brightener |
4–6 mL/L |
| Operating Temperature |
40–60 ℃ |
| pH Value |
10–11 |
| Anode Material |
Electrolytic copper plate |
| Agitation |
Air agitation + circulation filtration |