R·G-910 High Leveling Acid Copper Plating Additive
Performance & Features
- Innovative ultra-high concentrated composite formula with leveling power up to 95%.
- Easy bath control; coatings free of pinholes, low internal stress and ultra-high ductility.
- Extremely stable plating solution, crystal clear bright surface without fogging.
- High impurity tolerance and long bath service life.
Operating Parameters
| Item |
Concentration Range |
| Copper Sulfate Pentahydrate (CuSO₄·5H₂O) |
160–210 g/L |
| Pure Sulfuric Acid (Specific gravity=1.84) |
50–70 g/L |
| Chloride Ion |
60–120 mg/L (ppm) |
| R·G-910 MU Make-up Agent |
4–10 mL/L |
| R·G-910 A Primary Brightener |
0.4–0.8 mL/L |
| R·G-910 B Primary Brightener |
0.3–0.5 mL/L |
| Operating Temperature |
20–30 ℃ |
| Cathode Current Density |
1–8 A/dm² |
| Anode Current Density |
0.5–3.0 A/dm² |
| Anode Material |
Phosphor copper balls (0.03–0.06% P) |
| Agitation |
Air agitation or mechanical agitation |