Electroplating Additives for Plastic Copper Sulfate Baths
High-performance 210 copper sulfate brightener specifically formulated for plastic electroplating applications, delivering superior adhesion and leveling while preventing harmful decomposition products.
Key Product Benefits
- Ideal for plastic electroplating with no pinholes or pitting on coating surfaces
- Stable brightener performance with minimal harmful decomposition products
- Excellent leveling capability for perfect mirror gloss finish
- Superior adhesion properties for durable coatings
- Unaffected by brightener decomposition products
Process Parameters
| Parameter |
Range |
| Copper Sulfate |
160-240 g/L |
| Sulfuric Acid |
40-90 g/L |
| Chloride Ion |
30-120 mg/L |
| 210MU Cylinder Opening Agent |
2-5 ml/L |
| 210A Leveling Agent |
0.3-0.6 ml/L |
| 210B Brightener Addition |
As required for supplementation |
| Temperature Range |
18-38 ℃ |
| Cathode Current Density |
1.5-8 A/dm² |
| Anode Current Density |
0.5-3 A/dm² |
| Voltage |
2-4 V |
Operating Conditions
• Vigorous air stirring
• Continuous filtration
• Phosphorus-containing copper anode