0.96 Inch OLED Display Module 128x64 Resolution with I2C/SPI Interface
This high-performance 0.96-inch OLED display module features a 128×64 dot matrix resolution and supports dual I2C/SPI interfaces for flexible integration. Equipped with SH1107 driver IC and COG (Chip on Glass) packaging, it offers an excellent aperture rate of 78% and clear visual performance. With a compact design, precise pixel parameters, and reliable structure, it's ideal for portable electronics, IoT devices, DIY projects, smart sensors, and small-scale display applications requiring high integration and space-saving solutions.
Key Specifications
| Product | 0.96 inch OLED Module | Module Number | GME64128-12 |
| Resolution | 128(H)×64(V) dots | Display Color | White |
| Active Area | 10.86(W)×21.74(H) mm | Interface Type | I2C / SPI |
| Pixel Pitch | 0.17(W)×0.17(H) mm | Pixel Size | 0.15(W)×0.15(H) mm |
| Driver IC | SH1107 | Aperture Rate | 78% |
| IC Package Type | COG (Chip on Glass) | FPC P/N | TBD |
Product Highlights: 0.96-inch OLED display, 128×64 resolution, SH1107 driver IC, dual I2C/SPI interfaces, 78% aperture rate, 0.17×0.17mm pixel pitch, COG packaging, compact size, white monochrome display, high integration, ideal for space-constrained devices
Technical Features
- COG (Chip on Glass) packaging technology ensures compact size and high reliability, perfect for space-limited electronic devices
- Dual I2C/SPI interface support provides flexible connection options, compatible with mainstream MCUs (Arduino, Raspberry Pi, etc.)
- 78% high aperture rate maximizes light transmittance, delivering clear and vivid display effects for text and simple graphics
- Precise pixel parameters (0.17mm pitch, 0.15mm size) ensure sharp image quality and uniform display performance
- Sturdy structural design with cover glass and polarizer protection, enhancing durability and resistance to external impacts
- Optimized FPC design for easy soldering and integration, reducing assembly difficulty and improving production efficiency
- Compliant with standard display module design specifications, ensuring strong compatibility with existing system architectures
Pin Definition
| PIN | Symbol |
|---|
| 1 | NC |
| 2 | VPP |
| 3 | VCOMH |
| 4 | VDD |
| 5 | IM1 |
| 6 | IREF |
| 7 | CS |
| 8 | RES |
| 9 | DC |
| 10 | D0 |
| 11 | D1 |
| 12 | VSS |
| 13 | NC |
Application Scenarios
- Portable electronic devices (handheld meters, mini data loggers, portable detectors)
- IoT terminals and smart sensors (environmental monitors, wireless controllers, sensor nodes)
- DIY electronics and hobby projects (Arduino/Raspberry Pi compatible displays, maker projects)
- Small-scale consumer electronics (smart home remote controls, mini POS machines, wearable accessories)
- Industrial control auxiliary displays (compact PLC panels, sensor data indicators)
- Medical portable equipment (small diagnostic devices, health monitors)
- Automotive auxiliary displays (in-vehicle small function displays, control panels)
Customization Options
- FPC Design: Flexible adjustment of FPC length and pin layout to match specific system integration requirements
- Interface Configuration: Optimized I2C/SPI interface parameters for compatibility with special MCUs or processors
- Polarizer Customization: Optional polarizer specifications based on viewing angle and contrast requirements
- Packaging Solution: Custom anti-static packaging, vacuum packaging with desiccant for long-term storage and transportation
- Quality Inspection: Enhanced quality control and testing processes for bulk orders (aging test, performance calibration)
Handling Notes
- Electrostatic Protection: Use anti-static bracelets and grounded tools during handling and assembly. Avoid touching FPC pins, IC chips, or display surfaces directly with bare hands to prevent electrostatic damage.
- Cleaning Instructions: The polarizer and cover glass surfaces are scratch-sensitive. Clean gently with lint-free cloth or specialized cleaning tape. Do not use corrosive solvents (alcohol, ketones) as they may damage the display layer.
- Storage Conditions: Store in sealed anti-static bags with desiccant at 0℃~30℃ and relative humidity ≤60%. Avoid direct sunlight, high temperature/humidity, or extreme cold environments. Reseal immediately after partial use.
- Assembly Precautions: Do not apply excessive pressure to the glass panel or bend the FPC forcibly (bending radius ≥5mm). Ensure correct pin soldering (soldering temperature ≤260℃, soldering time ≤3 seconds) to avoid damaging the FPC or IC.
- Operation Sequence: Follow the correct power-on/power-off sequence (VDD first, then signal pins; power off in reverse order) to protect the driver IC and extend module service life. Avoid long-term fixed-pattern display to prevent image retention.