MachineU > China Products
8 Layer Multilayer High Density Interconnect HDI PCB Board FR4 1.2mm Thickness
8 Layer Multilayer High Density Interconnect HDI PCB Board FR4 1.2mm Thickness
Specifications
Material :
FR4
Minimum Hole Size :
0.1 mm
Minimum Line Spacing :
0.075 mm
Supply Ability :
1 Million Square feet/per month
Board Thickness :
1.2mm
Copper Thickness :
1/1/1/1/1/1/1/1 oz
Model Number :
XSWPCB
Price :
Negotiable
Minimum Line Width :
0.05 mm
Certification :
UL ,IOS9000
Brand Name :
XSW PCB
Place of Origin :
China
Payment Terms :
Western Union
MOQ :
1
Delivery Time :
8-15DAYS
Layer Count :
8-Layer
Description
Customizable High-Density Interconnect (HDI) PCB Boards

This product is tailor-made for industrial PLC automation control systems, delivering a reliable and smooth human-machine interaction (HMI) operating experience while providing a comprehensive application solution.

Key Specifications
Layer Count 8-Layer
Material FR4
Board Thickness 1.2mm
Copper Thickness 1/1/1/1/1/1/1/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.05 mm
Minimum Line Spacing 0.075 mm
Solder Mask Color Green
Surface Finish OSP
Application Field High-Density Interconnect

Product Description
High-Density Interconnect (HDI) Technology

High-Density Interconnect (HDI) utilizes microvias with a diameter of ≤0.15 mm, employing advanced fine-line patterning and microvia formation techniques to achieve interconnection of components within an ultra-compact form factor. Its architectural design — characterized by minimized conductor geometries and optimized layer stacking — enables a wiring density that is an order of magnitude higher than that of conventional printed circuit boards (PCBs), making it essential for high-performance miniaturized systems.

Electrical performance is significantly enhanced through precise control of parasitic effects: residual stub inductance is reduced, discrete decoupling capacitors are eliminated via integrated power/ground planes, and crosstalk is minimized through controlled impedance routing. Furthermore, through the strategic placement of thin HDI dielectric layers, radiated electromagnetic interference (RFI/EMI) is lowered by minimizing loop inductance and uniformly distributing capacitance, thereby optimizing signal integrity along high-frequency transmission paths.

  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
Send your message to this supplier
Send Now

8 Layer Multilayer High Density Interconnect HDI PCB Board FR4 1.2mm Thickness

Ask Latest Price
Product Detail
Material :
FR4
Minimum Hole Size :
0.1 mm
Minimum Line Spacing :
0.075 mm
Supply Ability :
1 Million Square feet/per month
Board Thickness :
1.2mm
Copper Thickness :
1/1/1/1/1/1/1/1 oz
Contact Supplier
8 Layer Multilayer High Density Interconnect HDI PCB Board FR4 1.2mm Thickness

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products HDI Printed Circuit Board
MachineU China Products
Contact Supplier
Submit Requirement