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6 Layer HDI Printed Circuit Board Multilayer Control PCB Board Customized
6 Layer HDI Printed Circuit Board Multilayer Control PCB Board Customized
Specifications
Model Number :
XSWPCB
Material :
FR4
MOQ :
1
Delivery Time :
8-15DAYS
Payment Terms :
Western Union
Supply Ability :
1 Million Square feet/per month
Certification :
UL ,IOS9000
Board Thickness :
1.6mm (Customizable)
Place of Origin :
China
Copper Thickness :
1/1/1/1/1/1 oz
Price :
Negotiable
Brand Name :
XSW PCB
Layer Count :
6-Layer
Description
HDI Multilayer PCB Customized 6 Layers Control PCB Board

This 6-layer 1st-order HDI (High-Density Interconnect) PCB features immersion gold (ENIG) surface finish with green oil solder mask, specifically engineered for applications requiring high-density routing and reliable blind via interconnects. The 1+N+1 stack-up structure with laser-drilled blind vias ensures superior signal integrity and space optimization for compact electronic devices. Rigorous process control is applied to laser blind via formation, solder mask development matching, and ENIG plating quality to deliver consistent PCB performance for demanding electronics applications.

Key Specifications
Layer Count 6-Layer
Material FR4
Board Thickness 1.6mm (Customizable)
Copper Thickness 1/1/1/1/1/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.075 mm
Minimum Line Spacing 0.075 mm
Solder Mask Color Green
Surface Finish Immersion Gold (ENIG)

Product Description

  • Laser Blind Via Precision: Laser-drilled blind vias with aperture tolerance controlled at ±10μm, ensuring consistent interconnect reliability between layer 1-2 and layer 5-6.
  • ✓Desmear Backlight Level ≥9: Post-desmear backlight inspection guarantees level 9 or above, effectively eliminating copper plating voids in blind via holes.
  • ✓ENIG Surface Finish: Nickel thickness 3-5μm and gold thickness 0.05-0.1μm measured before immersion gold process. Strict black pad prevention protocol enforced throughout production.
  • ✓Solder Mask Registration: Green oil solder mask with blind via opening offset ≤25μm. Post-curing at 150°C for 60 minutes ensures optimal adhesion and long-term reliability.
  • ✓Thermal Stress Reliability: 288°C thermal stress test for 10 seconds performed before electrical testing to verify blind via bottom integrity with zero delamination.
  • ✓Solder Mask Development Matching: Optimized solder mask development process precisely matched to laser blind via characteristics for consistent imaging and resolution.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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6 Layer HDI Printed Circuit Board Multilayer Control PCB Board Customized

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Product Detail
Model Number :
XSWPCB
Material :
FR4
MOQ :
1
Delivery Time :
8-15DAYS
Payment Terms :
Western Union
Supply Ability :
1 Million Square feet/per month
Contact Supplier
6 Layer HDI Printed Circuit Board Multilayer Control PCB Board Customized

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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