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4 Layer 1+N+1 HDI Printed Circuit Board Assembly With Laser Microvias ENIG Finish
4 Layer 1+N+1 HDI Printed Circuit Board Assembly With Laser Microvias ENIG Finish
Specifications
Model Number :
XSWPCB
Material :
FR-4 TG150
MOQ :
1
Delivery Time :
8-15DAYS
Payment Terms :
Western Union
Supply Ability :
1 Million Square feet/per month
Certification :
UL ,IOS9000
Board Thickness :
0.33mm (Customizable)
Place of Origin :
China
Copper Thickness :
1/0.5/0.5/1 oz
Price :
Negotiable
Brand Name :
XSW PCB
Layer Count :
4-Layer
Description
Custom 4 Layer 1+N+1 HDI PCB Board Assembly with Laser Microvias and ENIG Finish

Custom 4 Layer 1+N+1 HDI PCB Board Assembly with Laser Microvias and ENIG Finish is designed for high-density electronic applications that require enhanced signal integrity, compact layouts, and reliable performance. Utilizing advanced laser-drilled microvia technology, this HDI PCB enables higher routing density, reduced signal loss, and improved electrical performance compared to conventional multilayer boards. The 1+N+1 stack-up structure provides an ideal balance between complexity, cost efficiency, and manufacturing reliability.

Key Specifications
Layer Count 4-Layer
Material FR-4 TG150
Board Thickness 0.33mm (Customizable)
Copper Thickness 1/0.5/0.5/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.075 mm
Minimum Line Spacing 0.075 mm
Solder Mask Color Black
Surface Finish Immersion Gold (ENIG)

Product Description

  • Advanced 1+N+1 HDI Structure
    • Optimized stack-up design with laser-drilled microvias for higher routing density and improved circuit integration.
    • Ideal for compact and high-performance electronic products.
  • Laser Microvia Technology
    • Precision laser-drilled blind vias ensure reliable interconnection between layers.
    • Supports fine-pitch components and complex PCB layouts.
  • High-Density Interconnect Design
    • Enables more components to be placed within limited board space.
    • Reduces PCB size while maintaining excellent electrical performance.
  • Premium ENIG Surface Finish
    • Excellent solderability and flat surface for SMT assembly.
    • Superior oxidation resistance and extended shelf life.
    • Suitable for BGA, QFN, and other fine-pitch packages.
  • Enhanced Signal Integrity
    • Shorter signal paths help minimize signal loss and electromagnetic interference (EMI).
    • Supports high-speed and high-frequency circuit applications.
  • Improved Reliability and Durability
    • Strong interlayer connections provide excellent mechanical and thermal reliability.
    • Designed for long-term operation in demanding environments.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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4 Layer 1+N+1 HDI Printed Circuit Board Assembly With Laser Microvias ENIG Finish

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Product Detail
Model Number :
XSWPCB
Material :
FR-4 TG150
MOQ :
1
Delivery Time :
8-15DAYS
Payment Terms :
Western Union
Supply Ability :
1 Million Square feet/per month
Contact Supplier
4 Layer 1+N+1 HDI Printed Circuit Board Assembly With Laser Microvias ENIG Finish

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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