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8 Layer Multilayer HDI PCB Manufacturing Service For Industrial Consumer Electronics
8 Layer Multilayer HDI PCB Manufacturing Service For Industrial Consumer Electronics
Specifications
Model Number :
XSWPCB
Material :
FR-4 TG150
MOQ :
1
Delivery Time :
8-15DAYS
Minimum Hole Size :
0.1 mm
Payment Terms :
Western Union
Supply Ability :
1 Million Square feet/per month
Certification :
UL ,IOS9000
Board Thickness :
0.75mm (Customizable)
Place of Origin :
China
Copper Thickness :
1/1/1/1/1/1/1/1 oz
Price :
Negotiable
Brand Name :
XSW PCB
Layer Count :
8-Layer
Description
8-Layer Multilayer HDI PCB Manufacturing Service for Industrial and Consumer Electronics

We provide one-stop OEM manufacturing services for 8-layer HDI multilayer PCBs, tailored to diverse industrial and consumer electronic applications. Our production line supports advanced high-density interconnect structures with precise microvia fabrication, ultra-fine line width/spacing and miniature micro-hole processing to meet miniaturization, high-speed signal transmission and high-reliability demands of modern electronics.

Key Specifications
Layer Count 8-Layer
Material FR-4 TG150
Board Thickness 0.75mm (Customizable)
Copper Thickness 1/1/1/1/1/1/1/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Blue
Surface Finish Immersion Gold (ENIG)

Product Description

Advanced 8-layer HDI multilayer circuit board customization, supporting 1st-order, 2nd-order and stacked microvia structures to realize ultra-compact PCB layout for miniaturized electronic products.

Precision micro-processing capability: capable of ultra-fine line width/space, tiny microvias and ultra-thin finished board thickness with strict dimensional tolerance control.

Multiple customizable surface finishes available, including ENIG, OSP, HASL, Immersion Silver and Hard Gold to match different soldering, conductivity and anti-corrosion requirements.

Strict impedance control, high-speed signal integrity optimization and reliable thermal performance design for high-frequency, high-power industrial and consumer electronic equipment.

Full one-stop OEM service covering DFM design review, prototype sampling, small batch trial run and large-scale mass production.

Complete quality inspection system: AOI, AXI, electrical continuity test, thermal cycling test and reliability aging test to guarantee long-term stable product performance.

Design Specifications

Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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8 Layer Multilayer HDI PCB Manufacturing Service For Industrial Consumer Electronics

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Product Detail
Model Number :
XSWPCB
Material :
FR-4 TG150
MOQ :
1
Delivery Time :
8-15DAYS
Minimum Hole Size :
0.1 mm
Payment Terms :
Western Union
Contact Supplier
8 Layer Multilayer HDI PCB Manufacturing Service For Industrial Consumer Electronics

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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