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Multi Head Die Bonder Equipment For Optical Modules / HDMI USB Connectors
Multi Head Die Bonder Equipment For Optical Modules / HDMI USB Connectors
Specifications
Cycle Time :
3s-12s (Depending on product)
Placement Accuracy :
±3 @3σ (Depending on product)
Angular Accuracy :
±0.5° @3σ (Depending on product)
Tray Size :
Customer Provided
Bonding Force :
20-300g (Customizable)
Standard Track Width :
40-90mm (Customizable)
Brand Name :
UW
Certification :
CE ISO
MOQ :
1set
Price :
Negotiation
Packaging Details :
carton box/wooden box
Payment Terms :
T/T
Description

Equipment Overview

This equipment is designed for the high-precision assembly of optical modules, HDMI/USB connectors, sensors, optical devices, light source modules, and driver modules

Highlights

  • High precision assembly: SP class silent linear guides with straightness within 2 μm; laser interferometer motion compensation; placement accuracy ±0.8 μm; repeatability ±0.4 μm. Supports fast, high‑precision timing of 6 pulses in 100 ms, ensuring consistent accuracy across production units and minimizing precision degradation from moving components.
  • Reduced misjudgment: Independent micro‑flow air circuits per nozzle enable individual loop detection, lowering system false judgments.
  • Strong compatibility: Simultaneously supports placement of optical chips and electrical chips.
  • Professional support: A dedicated vision team provides customized, efficient, and accurate positioning solutions for various products.
  • Customization: Upgradeable to a eutectic bonder with the addition of a eutectic module.

Specifications

Parameter Name Parameter Value
Cycle Time 3s-12s (Depending on product)
Placement Accuracy ±3 @3σ (Depending on product)
Angular Accuracy ±0.5° @3σ (Depending on product)
Die Size 0.15×0.15mm - 5×5mm (Lens change required based on product)
Die Thickness 0.076 - 1mm (3 - 40mil, Standard). Min. 0.05mm (2mil, Optional)
Lead Frame Size L: 100 - 300mm; W: 40 - 90mm (Customization required for <40mm). H: 0.1-0.8mm (Standard), 0.8-2.0mm (Optional)
Tray Size Customer Provided
Wafer Size Compatible with 6-8 inch wafers (2-inch, 4-inch waffle packs)
Auto θ Calibration ±15° Range
Max Wafer Angular Correction 360°
Bonding Force 20-300g (Customizable)
Standard Track Width 40-90mm (Customizable)
PR System 256 Grayscale / Edge Detection
Resolution 1920pixel×2560pixel (Customizable)
PR Accuracy 5M (1920×2560pixel) FOV (16mm;×1,×2,×4)
Angular Tolerance ±0.1
Dimensions W: 1630mm; H: 1160mm; D: 1500mm (Subject to final product)
Weight 1200KG (Subject to final product)

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Multi Head Die Bonder Equipment For Optical Modules / HDMI USB Connectors

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Product Detail
Cycle Time :
3s-12s (Depending on product)
Placement Accuracy :
±3 @3σ (Depending on product)
Angular Accuracy :
±0.5° @3σ (Depending on product)
Tray Size :
Customer Provided
Bonding Force :
20-300g (Customizable)
Standard Track Width :
40-90mm (Customizable)
Contact Supplier
Multi Head Die Bonder Equipment For Optical Modules / HDMI USB Connectors

United Winners Laser Co., Ltd

Verified Supplier
1 Years
shenzhen
Since 2005
Business Type :
Manufacturer
Main Products :
Lasers and Welding Machines, EV Battery Manufacturing Equipment, 3C Industry Manufacturing Equipment
Total Annual :
5000000-8000000
Employee Number :
5000~6000
Certification Level :
Verified Supplier
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