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Dual Drive Gantry Platform Die Bonder Machine With Customized Feeding System
Dual Drive Gantry Platform Die Bonder Machine With Customized Feeding System
Specifications
Cycle Time :
1.5s (Depends on product)
XY Placement Accuracy :
±20μm @ 3σ (Standard die accuracy)
Die Rotation :
±0.5° @ 3σ (Depends on product)
Size Range :
200*250mm
Bonding Force :
20-300g (Customizable)
Resolution :
5472pixel × 3648pixel (Customizable)
Brand Name :
UW
Certification :
CE ISO
MOQ :
1set
Price :
Negotiation
Packaging Details :
carton box/wooden box
Payment Terms :
T/T
Description

Equipment Overview

The equipment adopts a dual-drive gantry platform and a customized feeding system. It is compatible with Gel-Pak, Wafer Pak, blister trays, and special fixtures, making it suitable for micro-assembly applications in the pump source industry.

Highlights

  • Multi-Component Compatibility: Simultaneously supports the placement of SAC, PBS, and PBC components.
  • High Placement Accuracy: Up to ±20 μm (standard configuration).
  • Precision Arrangement: Capable of traying/arranging COS chips and solder preforms.
  • Versatile Shim Handling: Supports the placement of both large and small shims.

Technical Specifications

Parameter Name Specification
Cycle Time 1.5s (Depends on product)
XY Placement Accuracy ±20μm @ 3σ (Standard die accuracy)
Die Rotation ±0.5° @ 3σ (Depends on product)
Die Size 0.15×0.15mm - 5×5mm (Lens change required based on product)
Die Thickness 0.076 - 1mm (3 - 40mil, Standard) Min. 0.05mm (2mil, Optional)
Lead Frame Size L: 100-300mm; W: 40-90mm (Customization required for <40mm); H: 0.1-0.8mm (Standard), 0.8 - 2.0mm (Optional)
Tray Size (Provided by customer based on product)
Size Range 200*250mm
Alignment Standard Center clamping, Y-direction edge alignment
Bonding Force 20-300g (Customizable)
Pick-up Method Blister tray, Metal tray
PR System 256 Grayscale
Resolution 5472pixel × 3648pixel (Customizable)
PR Accuracy FOV (16.4mmX10.9mm)
Angle Tolerance ±0.1°
Dimensions W: 1240mm; H: 1550mm; D: 1800mm (Subject to final product)
Weight 1500KG (Subject to final product)

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Dual Drive Gantry Platform Die Bonder Machine With Customized Feeding System

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Product Detail
Cycle Time :
1.5s (Depends on product)
XY Placement Accuracy :
±20μm @ 3σ (Standard die accuracy)
Die Rotation :
±0.5° @ 3σ (Depends on product)
Size Range :
200*250mm
Bonding Force :
20-300g (Customizable)
Resolution :
5472pixel × 3648pixel (Customizable)
Contact Supplier
Dual Drive Gantry Platform Die Bonder Machine With Customized Feeding System

United Winners Laser Co., Ltd

Verified Supplier
1 Years
shenzhen
Since 2005
Business Type :
Manufacturer
Main Products :
Lasers and Welding Machines, EV Battery Manufacturing Equipment, 3C Industry Manufacturing Equipment
Total Annual :
5000000-8000000
Employee Number :
5000~6000
Certification Level :
Verified Supplier
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