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Precision Pre Sintering Die Bonder Equipment For Automotive Grade SiC Chips
Precision Pre Sintering Die Bonder Equipment For Automotive Grade SiC Chips
Specifications
Cycle Time :
4000ms (Dependent on product)
Force Control :
20g-300g
Die Size :
0.15×0.15mm-15×15mm
Capacity :
1000 pcs/h (Depending on jig matrix density)
Conveyor Width :
200*350mm (Customizable)
PR System :
256 Grayscale
Brand Name :
UW
Certification :
CE ISO
MOQ :
1set
Price :
Negotiation
Packaging Details :
carton box/wooden box
Payment Terms :
T/T
Description

Equipment Overview

This equipment is configured with a dual-drive gantry platform and a customized feeding platform, compatible with expansion rings, feeders, Wafer PAK, and vibratory bowls. It can handle a variety of materials and processes, including silver paste and silver film, and is suitable for automotive-grade SiC chips, DTS, clips, NTCs, resistors, etc.

Highlights

  • Powerful & Precision Bonding: 30kgf force + 250°C high temperature
  • Dual-Process Support: Silver paste / Silver film
  • Fully Automatic Gantry System
  • Flexible Feeding Configuration

Technical Parameters

Parameter Name Parameter Values
Cycle Time 4000ms (Dependent on product)
XY Placement Accuracy ±15μm @ 3σ (Standard die accuracy; actual product accuracy depends on incoming materials)
Theta Range ±1° @3σ
Force Control 20g-300g
Die Size 0.15×0.15mm-15×15mm
Die Thickness ≥ 70um
NTC Tape & Reel, Electronic Feeder
Capacity 1000 pcs/h (Depending on jig matrix density)
Magazine 4inch Gel-PAK,Wafer-PAK (Customizable)
Conveyor Width 200*350mm (Customizable)
PR System 256 Grayscale
Resolution 1920pixel×2560pixel (Customizable)
PR Accuracy 5M(1920×2560pixel) FOV(16mm；×1,×2,×4)
Dimensions (L×W×H) 1600×1250×2000mm (L×W×H)
Weight 2000kg

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Precision Pre Sintering Die Bonder Equipment For Automotive Grade SiC Chips

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Product Detail
Cycle Time :
4000ms (Dependent on product)
Force Control :
20g-300g
Die Size :
0.15×0.15mm-15×15mm
Capacity :
1000 pcs/h (Depending on jig matrix density)
Conveyor Width :
200*350mm (Customizable)
PR System :
256 Grayscale
Contact Supplier
Precision Pre Sintering Die Bonder Equipment For Automotive Grade SiC Chips

United Winners Laser Co., Ltd

Verified Supplier
1 Years
shenzhen
Since 2005
Business Type :
Manufacturer
Main Products :
Lasers and Welding Machines, EV Battery Manufacturing Equipment, 3C Industry Manufacturing Equipment
Total Annual :
5000000-8000000
Employee Number :
5000~6000
Certification Level :
Verified Supplier
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