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Customized Automatic Die Bonder Machine For FRD IGBT Chips Resistors
Customized Automatic Die Bonder Machine For FRD IGBT Chips Resistors
Specifications
Cycle Time :
4000ms (Dependent on product)
Die Size :
0.15×0.15mm-15×15mm
Die Thickness :
Thickness: ≥70um
NTC :
Tape & Reel, Electronic Feeder
Capacity :
2000-4000 pcs/h (Depending on jig matrix density)
Brand Name :
UW
Certification :
CE ISO
MOQ :
1set
Price :
Negotiation
Packaging Details :
carton box/wooden box
Payment Terms :
T/T
Description

Equipment Overview

The equipment is designed for the pick-and-place (P&P) of FRD, IGBT chips, resistors, and soldering tabs. It can operate as a standalone unit or be integrated into a multi-machine line for sequential processing. Target applications include automotive electronics, renewable energy, industrial controls, home appliances, and rail transportation.

Highlights

• Automatic thimble module replacement, solving the problem of large differences in chip sizes;

• Automatic wafer exchange and film expansion, compatible with 8" ~ 12" wafers;

• Customized feeding platform supporting four feeding methods: blue film, tray, feeder, and vibratory bowl; with automatic cutting and shaping of soldering tabs;

• Six sets of nozzles designed for large size differences, with automatic nozzle switching.

Technical Parameters

Parameter Name Parameter Values
Cycle Time 4000ms (Dependent on product)
XY Placement Accuracy ±10μm @ 3σ (Equipment accuracy, actual product accuracy depends on incoming materials)
Theta Range ±1°@3σ
Force Control 20g-300g
Die Size 0.15×0.15mm-15×15mm
Die Thickness Thickness: ≥70um
NTC Tape & Reel, Electronic Feeder
Capacity 2000-4000 pcs/h (Depending on jig matrix density)
Magazine 4 inch Gel-PAK,Wafer-PAK (Customizable)
Wafer Size 12-inch (Backward compatible with 10-inch, 8-inch)
Auto Theta Calibration ±10°
Conveyor Width 500*350mm (Customizable)
PR System 256 Gray Levels
Resolution 1920pixel×2560pixel (Customizable)
PR Accuracy 5M(1920×2560pixel)FOV(16mm；×1,×2,×4)
Dimensions 1600×1250×2000mm (L×W×H)
Weight 2000kg

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Customized Automatic Die Bonder Machine For FRD IGBT Chips Resistors

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Product Detail
Cycle Time :
4000ms (Dependent on product)
Die Size :
0.15×0.15mm-15×15mm
Die Thickness :
Thickness: ≥70um
NTC :
Tape & Reel, Electronic Feeder
Capacity :
2000-4000 pcs/h (Depending on jig matrix density)
Brand Name :
UW
Contact Supplier
Customized Automatic Die Bonder Machine For FRD IGBT Chips Resistors

United Winners Laser Co., Ltd

Verified Supplier
1 Years
shenzhen
Since 2005
Business Type :
Manufacturer
Main Products :
Lasers and Welding Machines, EV Battery Manufacturing Equipment, 3C Industry Manufacturing Equipment
Total Annual :
5000000-8000000
Employee Number :
5000~6000
Certification Level :
Verified Supplier
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