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XC6SLX150-2FGG676I Programmable IC Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources
Shenzhen Sai Collie Technology Co., Ltd.

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ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication
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BGA Package Solder Paste DIP Turnkey PCB Assembly 700*460mm
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Chengdu Cesgate Technology Co., Ltd

BGA Package Solder Paste DIP Turnkey PCB Assembly 700*460mm
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High Viscosity 3W/MK Thermally Conductive Putty For BGA Package
Dongguan Ziitek Electronical Material and Technology Co., Ltd

High Viscosity 3W/MK Thermally Conductive Putty For BGA Package
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DQS Electronic Co., Limited

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LTM4622IY 4A 20V Synchronous Step-Down µModule Regulator with 95% Efficiency 3.1-20V Input ±1.5% Output Accuracy 2.5MHz Switching and 6.25mm × 6.25mm BGA Package
TOP Electronic Industry Co., Ltd.

LTM4622IY 4A 20V Synchronous Step-Down µModule Regulator with 95% Efficiency 3.1-20V Input ±1.5% Output Accuracy 2.5MHz Switching and 6.25mm × 6.25mm BGA Package
Model：LTM4622IY
MOQ：1
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MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package
Mega Source Elec.Limited

MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package
Model：MPC8260AZUPIBB
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New Original E1116AEBG-8E-F BGA Packaged Flash Memory
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CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360
Model：CSR8645B04-IBBC-R
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ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B IC BGA Package
HK NeoChip Technology Limited

ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B IC BGA Package
Model：ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B
MOQ：10pieces
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ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B ADI IC BGA Package
Angel Technology Electronics Co

ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B ADI IC BGA Package
Model：ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B
MOQ：10pieces
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Semiconductor Industry Use Customizable Standard High Temperature BGA Package JEDEC Trays
Shenzhen Hiner Technology Co., Ltd.

Semiconductor Industry Use Customizable Standard High Temperature BGA Package JEDEC Trays
Model：HN23101
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IPQ4019-0vv IPQ4019 IPQ4019-OVV BGA package network chip new original
G-Resource Electronics Co.,Ltd

IPQ4019-0vv IPQ4019 IPQ4019-OVV BGA package network chip new original
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MOQ：10
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THGBMTG5D1LBAIL E-MMC products integrate flash memory and e-MMC controller into a single BGA package to perform functions such as error correction, loss balancing,
Shenzhen Hefengxin Technology Co., Ltd.

THGBMTG5D1LBAIL E-MMC products integrate flash memory and e-MMC controller into a single BGA package to perform functions such as error correction, loss balancing,
Model：THGBMTG5D1LBAIL
MOQ：760
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SMT Stencil Laser Cut 0.1mm Stainless Steel Shim for BGA Package with aluminum frame 520 mm x 420 mm x 20mm dimension
Shenzhen Bicheng Electronics Technology Co., Ltd

SMT Stencil Laser Cut 0.1mm Stainless Steel Shim for BGA Package with aluminum frame 520 mm x 420 mm x 20mm dimension
Model：BIC-0330-V3.30
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Custom BGA Assembly – Any Quantity Welcome
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Shenzhen Shinelink Technology Ltd

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