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High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages
High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages
Specifications
Payment Terms :
L/C,D/A,D/P,T/T
Line/Space Capability :
10/10 μm to 30/30 μm (SAP/MSAP)
Glass Transition Temperature :
180°C – 225°C (DSC)
Core Thickness :
40 – 200 μm
Brand Name :
Jiaqing Circuit
Price :
negotiate
Via Diameter :
50 – 100 μm
Surface Finish :
ENIG, ENEPIG, OSP
Layer Count :
2 – 12 layers
Material :
BT (Bismaleimide Triazine) resin
Certification :
ISO9001
Delivery Time :
15-30 Days
Place of Origin :
China
Description

BT IC substrate product line is engineered for advanced package formats including FC-CSP (Flip Chip Chip Scale Package) and WB-BGA (Wire Bond Ball Grid Array). BT resin, with its high glass transition temperature (180-225°C), low moisture absorption (0.3-0.5%), and fine-line capability (10/10 μm), enables high-density interconnection for memory controllers, RF modules, and mobile application processors. The substrate redistributes fine-pitch die bumps (40-130 μm pitch) to the coarser BGA ball array (400-1000 μm pitch) that interfaces with the main PCB. Available in 2-12 layer configurations with core thicknesses of 40-200 μm, these substrates support FC-CSP package sizes from 3*3 mm to 19*19 mm with bump pitches down to 0.15 mm.

Key Applications
Mobile AP & Logic ICs
FC-CSP packages on BT substrates offer compact form factors (3*3 mm to 19*19 mm) with fine bump pitch (≥0.15 mm), ideal for space-constrained mobile devices.
RF Modules & Wireless Communication
BT's stable Dk (3.4-4.0) and low Df (0.004-0.010) at 1 GHz provide reliable signal integrity for RF front-end modules and wireless transceivers.
System-in-Package (SiP) Integration
Multi-chip modules benefit from BT's dimensional stability and fine-line capability, enabling high-density interconnect for complex system integration.
Automotive & Industrial Electronics
High Tg (180-225°C) and excellent moisture resistance make BT substrates suitable for automotive-grade MCUs and industrial control applications requiring extended temperature cycling.
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High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages

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Product Detail
Payment Terms :
L/C,D/A,D/P,T/T
Line/Space Capability :
10/10 μm to 30/30 μm (SAP/MSAP)
Glass Transition Temperature :
180°C – 225°C (DSC)
Core Thickness :
40 – 200 μm
Brand Name :
Jiaqing Circuit
Price :
negotiate
Contact Supplier
High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages

Shenzhen Jiaqing Circuit Co., Ltd.

Verified Supplier
1 Years
shenzhen
Since 2012
Business Type :
Manufacturer
Main Products :
IC Substrate Board, PCBA, Standard PCB
Total Annual :
20000000-50000000
Employee Number :
201~300
Certification Level :
Verified Supplier
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