MachineU > China Products > Rubber & Plastics > Plastic Products > Automotive Plastic Products
High Reliability Automotive Grade BT IC Substrate for MCU and Sensor Applications
High Reliability Automotive Grade BT IC Substrate for MCU and Sensor Applications
Specifications
Core Thickness :
40 – 200 μm
Glass Transition Temperature :
180°C – 225°C (DSC)
Layer Count :
2 – 12 layers
Payment Terms :
L/C,D/A,D/P,T/T
Via Diameter :
50 – 100 μm
Surface Finish :
ENIG, ENEPIG, OSP
Place of Origin :
China
Certification :
ISO9001
Price :
negotiate
Material :
BT (Bismaleimide Triazine) resin
Delivery Time :
15-30 Days
Brand Name :
Jiaqing Circuit
Line/Space Capability :
10/10 μm to 30/30 μm (SAP/MSAP)
Description

BT IC substrate is engineered for automotive electronics requiring AEC-Q100 Grade 2 compatibility and extended temperature cycling reliability. BT resin's high glass transition temperature (180-225°C), low CTE (12-16 ppm/°C), and ultra-low moisture absorption (0.3-0.5%) provide the thermal and mechanical stability demanded by under-hood control modules, radar systems, and high-temperature environments. Available in 2-12 layer configurations with line/space down to 10/10 μm and ENIG/ENEPIG surface finishes, these substrates support wire-bond BGA packages (15*15 mm to 45*45 mm, 119-1520 balls) and FC-CSP packages for automotive MCUs, radar transceivers, and sensor fusion modules.

Applications & Key Advantages by Category
Automotive MCUs & ECUs
High Tg (180-225°C) and low moisture absorption ensure reliable operation in under-hood environments with extended temperature cycling (-40°C to +125°C).
Automotive Radar & ADAS
Stable dielectric properties (Dk 3.4-4.0, Df 0.004-0.010) support 77 GHz radar transceivers and ADAS sensor fusion modules.
Power Management ICs (PMIC)
Excellent thermal conductivity (0.35 W/m·K) and high decomposition temperature (≥325°C) support high-current automotive power management applications.
Wireless Connectivity (V2X, Bluetooth)
BT substrates support automotive-grade wireless MCU packages (e.g., 7*7 mm VQFN48) with wettable flanks for reliable solder joint inspection.
Send your message to this supplier
Send Now

High Reliability Automotive Grade BT IC Substrate for MCU and Sensor Applications

Ask Latest Price
Product Detail
Core Thickness :
40 – 200 μm
Glass Transition Temperature :
180°C – 225°C (DSC)
Layer Count :
2 – 12 layers
Payment Terms :
L/C,D/A,D/P,T/T
Via Diameter :
50 – 100 μm
Surface Finish :
ENIG, ENEPIG, OSP
Contact Supplier
High Reliability Automotive Grade BT IC Substrate for MCU and Sensor Applications

Shenzhen Jiaqing Circuit Co., Ltd.

Verified Supplier
1 Years
shenzhen
Since 2012
Business Type :
Manufacturer
Main Products :
IC Substrate Board, PCBA, Standard PCB
Total Annual :
20000000-50000000
Employee Number :
201~300
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products IC Substrate Board
MachineU China Products Rubber & Plastics Plastic Products Automotive Plastic Products
Contact Supplier
Submit Requirement