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High Frequency Low Loss BT IC Substrate for 5G RF Modules and Antenna in Package Applications
High Frequency Low Loss BT IC Substrate for 5G RF Modules and Antenna in Package Applications
Specifications
Place of Origin :
China
Glass Transition Temperature :
180°C – 225°C (DSC)
Via Diameter :
50 – 100 μm
Brand Name :
Jiaqing Circuit
Line/Space Capability :
10/10 μm to 30/30 μm (SAP/MSAP)
Surface Finish :
ENIG, ENEPIG, OSP
Delivery Time :
15-30 Days
Layer Count :
2 – 12 layers
Certification :
ISO9001
Material :
BT (Bismaleimide Triazine) resin
Payment Terms :
L/C,D/A,D/P,T/T
Core Thickness :
40 – 200 μm
Price :
negotiate
Description

BT IC substrate is specifically engineered for high-frequency 5G RF modules, Antenna-in-Package (AiP), and millimeter-wave communication applications. Modified BT resin systems achieve dissipation factor (Df) as low as 0.005 @ 28 GHz through spherical silica-filled formulations. These substrates support 14-layer any-layer structures with embedded bandpass impedance transformers for compact 28 GHz AiP modules. With stable dielectric properties across frequency (Dk 3.4-4.0, Df 0.004-0.010 @ 1 GHz), BT substrates deliver signal transmission loss ≤0.015 dB/mm at 28 GHz, making them ideal for 5G front-end modules, automotive radar, and high-frequency communication systems.

Applications & Key Advantages by Category
5G mmWave Antenna-in-Package (AiP)

– 14-layer BT substrates with embedded bandpass impedance transformers enable compact 28 GHz antenna modules with stable passband characteristics and 15% fractional bandwidth.

RF Front-End Modules

– Low Df (≤0.005 @ 28 GHz) and signal loss ≤0.015 dB/mm ensure minimal signal degradation in 5G transceiver front-ends.

Automotive Radar Systems

– Stable dielectric properties across temperature and frequency make BT substrates suitable for 77 GHz automotive radar modules requiring high reliability under thermal cycling.

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High Frequency Low Loss BT IC Substrate for 5G RF Modules and Antenna in Package Applications

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Product Detail
Place of Origin :
China
Glass Transition Temperature :
180°C – 225°C (DSC)
Via Diameter :
50 – 100 μm
Brand Name :
Jiaqing Circuit
Line/Space Capability :
10/10 μm to 30/30 μm (SAP/MSAP)
Surface Finish :
ENIG, ENEPIG, OSP
Contact Supplier
High Frequency Low Loss BT IC Substrate for 5G RF Modules and Antenna in Package Applications

Shenzhen Jiaqing Circuit Co., Ltd.

Verified Supplier
1 Years
shenzhen
Since 2012
Business Type :
Manufacturer
Main Products :
IC Substrate Board, PCBA, Standard PCB
Total Annual :
20000000-50000000
Employee Number :
201~300
Certification Level :
Verified Supplier
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