HongRuiXing (Hubei) Electronics Co.,Ltd.

Verified Supplier
6 Years
shenzhen
Since 2010
Menu
Menu
Supplier homepage
Product categories
Show all products
BGA Substrate
IC Package Substrate
Sip Package Substrate
FCCSP Package Substrate
Sensors Substrate
RF Module Substrate
Memory Substrate
MEMS Substrate
IoT Substrate
Other Ultrathin Substrate
Ultrathin Rigid PCB
Medical Equipment PCB
Company profile
Quality control
Contact us

HongRuiXing (Hubei) Electronics Co.,Ltd.

HongRuiXing (Hubei) Electronics Co.,Ltd.
video
Business Type： Manufacturer
Main Products：

BGA Substrate

,  

IC Package Substrate

,  

Sip Package Substrate
Total Annual： 50million-100million
Employee Number： 100~200
Certification Level： Verified Supplier
HOREXS Group was located in CHINA mainland,has three subsidiaries:Boluo HongRuiXing Electronics Co., Ltd(Located in Huizhou city GuangDong),HongRuiXing (HuBei) Electronics Co.,Ltd(Located in HuBei province),Horexs Electronics (HK) Co.,Ltd(Located in HK),All are just located in difference place to meet our customers demand of ic substrate manufacture.Horexs supplies different kinds of IC substrate products. High quality and favorable price. We're pleased to get your Inquiry and we will come back to as soon as possible. We  stick to the principle of "quality first,...
Company Profile Quality Control

Popular Categories

BGA Substrate

BGA Substrate

25 products available

0.28mm Finished Lead Free memory chip substrate manufacture

OEM ODM semiconductor packaging substrate China mainland

0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate
View Details
IC Package Substrate

IC Package Substrate

47 products available

Hitachi BT IC Package Substrate production supporting

AUS308 PSR IC Package substrate manufacture

Precision 0.15mm IC Packaging Substrate fabrication
View Details
Sip Package Substrate

Sip Package Substrate

3 products available

Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System

Sip package substrate BT material 4 layer ENEPIG

Anylayer/Buildup types Sip packaging Substrate manufacture
View Details
FCCSP Package Substrate

FCCSP Package Substrate

6 products available

semiconductor FCCSP Package Substrate manufacture

BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly

0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material
View Details
Sensors Substrate

Sensors Substrate

3 products available

Sensors package substrate CMOS substrate manufacture supporting

Fingerprint sensors packaging substrate manufacture supporting

Semiconductor sensors substrate manufacture
View Details
RF Module Substrate

RF Module Substrate

2 products available

Camera / Bluetooth / Wireless Module Substrate BT 4L 0.21mm Soft Gold Finished

RF Module substrate impedance control 4L BT material soft gold
View Details
View More

New Products

View More
Contact Supplier
Submit Requirement