HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified Supplier
6 Years
shenzhen
Since 2010
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BGA Substrate
IC Package Substrate
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RF Module Substrate
Memory Substrate
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Other Ultrathin Substrate
Ultrathin Rigid PCB
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PRODUCT CATEGORIES

BGA Substrate

 (25)

IC Package Substrate

 (47)

Sip Package Substrate

 (3)

FCCSP Package Substrate

 (8)

Sensors Substrate

 (3)

RF Module Substrate

 (2)

Memory Substrate

 (21)

MEMS Substrate

 (3)

IoT Substrate

 (3)

Other Ultrathin Substrate

 (8)

Ultrathin Rigid PCB

 (16)

Medical Equipment PCB

 (1)
Product Categories

All Products

140
Choose from our all products, find out more, and feel free to inquiry us
FR4 core memory ic substrate manufacture
Ultrathin Rigid PCB

FR4 core memory ic substrate manufacture
Model：SC-01
MOQ：1000pieces
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Ultrathin Rigid PCB manufacture for microelectronics assembly
Ultrathin Rigid PCB

Ultrathin Rigid PCB manufacture for microelectronics assembly
Model：FC-02
MOQ：100pieces
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Gold Plated 0.1mm 0.4mm Thickness Rigid Fr4 PCB Circuit Board
Ultrathin Rigid PCB

Gold Plated 0.1mm 0.4mm Thickness Rigid Fr4 PCB Circuit Board
Supply Ability：30000 square meters per month
MOQ：1 square meter
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NAND memory substrate ultrathin FR4 core BT raw material
Ultrathin Rigid PCB

NAND memory substrate ultrathin FR4 core BT raw material
Supply Ability：30000 square meters per month
MOQ：1 square meter
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SIM Card Smart card pcb manufacture with ultrathin core
Ultrathin Rigid PCB

SIM Card Smart card pcb manufacture with ultrathin core
Supply Ability：30000 square meters per month
MOQ：1 square meter
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BT semiconductor IC packaging substrate manufacture
Other Ultrathin Substrate

BT semiconductor IC packaging substrate manufacture
Model：NC-01
MOQ：10 square meter
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Flash/NAND memory package substrate production
Other Ultrathin Substrate

Flash/NAND memory package substrate production
Model：NC-02
MOQ：1000pieces
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Multilayer BT materials semiconductor package substrate manufacture
Other Ultrathin Substrate

Multilayer BT materials semiconductor package substrate manufacture
Model：NC-02
MOQ：1000pieces
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CMOS sensors ic package manufacture supporting
Other Ultrathin Substrate

CMOS sensors ic package manufacture supporting
Supply Ability：30000 square meters per month
MOQ：1 square meter
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0.28mm Finished Lead Free memory chip substrate manufacture
BGA Substrate

0.28mm Finished Lead Free memory chip substrate manufacture
Model：OC-01
MOQ：100pieces
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OEM ODM semiconductor packaging substrate China mainland
BGA Substrate

OEM ODM semiconductor packaging substrate China mainland
Supply Ability：30000 square meters per month
MOQ：1 square meter
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0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate
BGA Substrate

0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate
Supply Ability：30000 square meters per month
MOQ：1 square meter
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RF/mmwave module substrate manufacture
BGA Substrate

RF/mmwave module substrate manufacture
Supply Ability：30000 square meters per month
MOQ：1 square meter
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microelectronics package substrate manufacture
BGA Substrate

microelectronics package substrate manufacture
Supply Ability：30000 square meters per month
MOQ：1 square meter
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Hitachi BT IC Package Substrate production supporting
IC Package Substrate

Hitachi BT IC Package Substrate production supporting
Supply Ability：30000 square meters per month
MOQ：1 square meter
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AUS308 PSR IC Package substrate manufacture
IC Package Substrate

AUS308 PSR IC Package substrate manufacture
Supply Ability：30000sqm/ month
MOQ：1000pieces
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Precision 0.15mm IC Packaging Substrate fabrication
IC Package Substrate

Precision 0.15mm IC Packaging Substrate fabrication
Model：NC-02
MOQ：1000pieces
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0.15mm IC assembly package substrate For semiconductor package
IC Package Substrate

0.15mm IC assembly package substrate For semiconductor package
Supply Ability：30000 square meters per month
MOQ：1000pieces
Contact Now
Hitachi brand BT material substrate manufacture
IC Package Substrate

Hitachi brand BT material substrate manufacture
Model：NC-02
MOQ：1000pieces
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4L build up types 0.8mm Gold Surface IC Package Substrate
IC Package Substrate

4L build up types 0.8mm Gold Surface IC Package Substrate
Supply Ability：30000 square meters per month
MOQ：1 square meter
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