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HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified Supplier
6
Years
shenzhen
Since 2010
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BGA Substrate
IC Package Substrate
Sip Package Substrate
FCCSP Package Substrate
Sensors Substrate
RF Module Substrate
Memory Substrate
MEMS Substrate
IoT Substrate
Other Ultrathin Substrate
Ultrathin Rigid PCB
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BGA Substrate
(25)
IC Package Substrate
(47)
Sip Package Substrate
(3)
FCCSP Package Substrate
(8)
Sensors Substrate
(3)
RF Module Substrate
(2)
Memory Substrate
(21)
MEMS Substrate
(3)
IoT Substrate
(3)
Other Ultrathin Substrate
(8)
Ultrathin Rigid PCB
(16)
Medical Equipment PCB
(1)
Company Profile
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Menu
Supplier homepage
Product categories
Show all products
BGA Substrate
IC Package Substrate
Sip Package Substrate
FCCSP Package Substrate
Sensors Substrate
RF Module Substrate
Memory Substrate
MEMS Substrate
IoT Substrate
Other Ultrathin Substrate
Ultrathin Rigid PCB
Medical Equipment PCB
Company profile
Quality control
Contact us
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BGA Substrate
PRODUCT CATEGORIES
BGA Substrate
(25)
IC Package Substrate
(47)
Sip Package Substrate
(3)
FCCSP Package Substrate
(8)
Sensors Substrate
(3)
RF Module Substrate
(2)
Memory Substrate
(21)
MEMS Substrate
(3)
IoT Substrate
(3)
Other Ultrathin Substrate
(8)
Ultrathin Rigid PCB
(16)
Medical Equipment PCB
(1)
Product Categories
BGA Substrate
25
Choose from our bga substrate products, find out more, and feel free to inquiry us
Hot selling!
BGA Substrate
0.28mm Finished Lead Free memory chip substrate manufacture
Model:
OC-01
MOQ:
100pieces
Contact Now
Hot selling!
BGA Substrate
OEM ODM semiconductor packaging substrate China mainland
Supply Ability:
30000 square meters per month
MOQ:
1 square meter
Contact Now
Hot selling!
BGA Substrate
0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate
Supply Ability:
30000 square meters per month
MOQ:
1 square meter
Contact Now
BGA Substrate
RF/mmwave module substrate manufacture
Supply Ability:
30000 square meters per month
MOQ:
1 square meter
Contact Now
BGA Substrate
microelectronics package substrate manufacture
Supply Ability:
30000 square meters per month
MOQ:
1 square meter
Contact Now
BGA Substrate
L/S 30um BT Wire Bonding Substrate ENEPIG / ENIG Hard Gold Soft Gold UL
Model:
HRX
MOQ:
1 square meter
Contact Now
BGA Substrate
MGC brand BT CSP package Substrate Fabrication
Model:
HRX
MOQ:
1 square meter
Contact Now
BGA Substrate
BGA Package of Memory Substrate with ENEPIG ENIG Soft Gold Surface
Model:
HRX
MOQ:
1 square meter
Contact Now
BGA Substrate
BT material semiconductor Pacakge Substrate L/S 35/35um
Model:
HRX
MOQ:
1 square meter
Contact Now
BGA Substrate
ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate
Model:
HRX
MOQ:
1 square meter
Contact Now
BGA Substrate
MCP package Substrate 0.5oz Copper Customize BT Material
Model:
HRX
MOQ:
1 square meter
Contact Now
BGA Substrate
4 Layer buildup types semiconductor Package Substrate production
Model:
HRX
MOQ:
1 square meter
Contact Now
BGA Substrate
BT material BGA semiconductor package Substrate production
Model:
HRX
MOQ:
1 square meter
Contact Now
BGA Substrate
L/S 30um BT Wire Bonding Substrate UL ENIG Hard Gold Soft Gold
Model:
HRX
MOQ:
1 square meter
Contact Now
BGA Substrate
BT ENEPIG 4 Layer Sip Package Substrate 0.24mm Finished Thickness
Model:
HRX
MOQ:
1 square meter
Contact Now
BGA Substrate
BT FR4 NAND Memory Substrate Board 35/35um 4 Layer ENEPIG
Model:
HRX
MOQ:
1 square meter
Contact Now
BGA Substrate
IC Chip Substrate Fabrication with BT(MGC/Hitachi) ENIG/Soft gold/ENEPIG
Model:
HRX
MOQ:
1 square meter
Contact Now
BGA Substrate
ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw material
Model:
HRX
MOQ:
1 square meter
Contact Now
BGA Substrate
FBGA Package substrate production supporting BT 40um core
Model:
HRX
MOQ:
1 square meter
Contact Now
BGA Substrate
semiconductor packaging Substrate of DRAM Memory manufacture
Model:
HRX
MOQ:
1 square meter
Contact Now
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