Product Description
This compact SMT PCB female connector provides a reliable 10-pin, 1.0mm pitch signal interface for dense electronic assemblies. The low-profile housing and side-entry structure save board space while offering secure mating with the matching header or plug. Copper-alloy contacts with optional gold plating deliver stable contact resistance and long-term durability under repeated insertion cycles.
Designed for automated production, the connector is supplied in tape-and-reel and is compatible with standard SMT reflow processes. Multiple customization options are available, including different pin counts, plating schemes, keying features and laser marking, enabling tailored solutions for specific PCB layouts or wire harness interfaces.
| Product type | SMT PCB female connector |
| Function | Board-level electrical / electronic signal connection |
| Number of positions | 10 pins |
| Contact pitch | 1.0 mm |
| Contact type | Receptacle contacts |
| Mounting style | Surface-mount, side-entry |
| Termination | SMD solder tails |
| Housing material | High-temperature thermoplastic, UL94 V-0 |
| Contact material | Copper alloy |
| Contact plating | Tin or gold over nickel (customizable) |
| Rated current | up to 1.0 A per contact |
| Rated voltage | up to 50 V AC/DC |
| Insulation resistance | ≥ 1,000 MΩ at 500 V DC |
| Contact resistance | ≤ 30 mΩ (initial) |
| Operating temperature | −40 °C to +105 °C |
| PCB recommendation | FR-4 PCB, solder mask defined pads |
| Packaging | Tape-and-reel for automated SMT placement |
| Custom options | Pin count, plating thickness, keying, logo marking |
Applications
PCB-to-board signal connector in automotive control modules, BMS and infotainment units
Compact interface on industrial controllers, PLC I/O boards and sensor modules
Signal connection on server, storage and communication equipment daughter cards
Board connector for customized wire harness assemblies in power tools and small appliances
Embedded interface for consumer electronics such as set-top boxes, cameras and smart devices
Precautions
Match with the recommended mating connector and observe the correct keying direction to avoid bending the pins.
Follow the specified pad layout and stencil design to achieve proper solder fillets and mechanical strength.
Observe the recommended reflow profile; excessive peak temperature or dwell time may deform the thermoplastic housing.
Do not exceed rated current and voltage; derate appropriately in high-ambient-temperature or sealed enclosures.
Keep contacts free from dust, flux residue and corrosive gases; store in original packaging before assembly to maintain performance.
