F4BTMS233 is an advanced iteration of the F4BTM series, developed through innovative enhancements to its formulation and production processes. By integrating a substantial ceramic content and reinforcing it with ultra-fine fiberglass fabric, this material delivers significantly improved performance characteristics, including a broader dielectric constant range. It qualifies as an aerospace-grade, highly reliable solution capable of serving as a direct replacement for comparable international materials.

The refined composition — minimal ultra-thin glass fabric combined with a high, uniform distribution of specialized nano-ceramic particles within the PTFE resin — minimizes glass-weave effects during signal transmission, reduces dielectric loss, and enhances dimensional stability. Anisotropy across the X, Y, and Z axes is reduced, while operating frequency range, electrical strength, and thermal conductivity are increased. The material also maintains a low coefficient of thermal expansion and stable dielectric properties over temperature variations.

Standard with RTF low-profile copper foil, the F4BTMS series lowers conductor loss while ensuring strong peel strength, and can be paired with either copper or aluminum substrates.

PCBs using this material are compatible with standard PTFE laminate processing techniques. Its superior mechanical and physical properties support multilayer, high-layer-count, and backplane designs, while also offering excellent manufacturability for high-density interconnects and fine-line circuitry.

Key Features

• Tight dielectric constant tolerance with consistent batch-to-batch performance.
• Exceptionally low dielectric loss.
• Stable dielectric constant and low loss up to 40 GHz, supporting phase-sensitive applications.
• Excellent temperature stability from –55°C to 150°C, ensuring reliable frequency and phase response.
• High radiation resistance with maintained electrical and mechanical properties post-exposure.
• Low outgassing, compliant with space-grade vacuum outgassing standards.
• Low CTE in X, Y, and Z directions for reliable dimensional stability and PTH integrity.
• Enhanced thermal conductivity for higher-power applications.
• Superior dimensional stability.
• Low moisture absorption.

Typical Applications

• Aerospace and avionics systems, including spaceborne and cabin equipment.
• Microwave and RF components.
• Radar and military radar systems.
• Feed networks.
• Phase-sensitive antennas and phased array antennas.
• Satellite communications and related systems.