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TLY-5 PCB Material Copper Clad Laminate
TLY-5 PCB Material Copper Clad Laminate
Specifications
Brand Name :
Bicheng
Model Number :
BIC-332.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Part number :
TLY-5
Laminate thickness :
0.089mm 0.127mm 0.191mm 0.254mm 0.508mm 0.762mm 1.524mm 3.175mm
Laminate size :
12X18 inch, 16X18 inch, 18X24 inch, 16X36 inch, 24X36 inch, 18X48 inch
Copper weight :
0.5OZ（0.018mm）1OZ（0.035mm）
Description

TLY-5 laminates are fabricated using ultra-lightweight woven fiberglass substrates, delivering superior dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiber matrix inherent to TLY-5 imparts enhanced mechanical robustness to the laminate, rendering it well-suited for high-volume production environments. Boasting a low dissipation factor, this material is ideally engineered for 77 GHz automotive radar systems and a broad spectrum of other millimeter-wave antenna applications.


Comparative OEM validation testing conducted at 77 GHz—pitting lightly reinforced TLY-5 against its closest chopped fiber-reinforced counterpart—has verified drop-in compatibility, with equivalent insertion loss and dielectric performance metrics. The key competitive advantage lies in TLY-5’s substantially higher manufacturing yields.


TLY-5 features a dielectric constant (Dk) range of 2.17–2.40. For the majority of available thicknesses, the Dk value can be customized to any point within this interval, with a tight tolerance of ±0.02. At 10 GHz, the material exhibits a dissipation factor (Df) of approximately 0.0009, a standout performance within the low-Dk material category.

TLY-5 PCB Material Copper Clad Laminate

Key Benefits

  • Exceptional dimensional stability
  • Industry-leading low dissipation factor
  • High peel strength
  • Minimal moisture absorption
  • Uniform, consistent dielectric constant
  • Laser ablatable

Typical Applications

  • Automotive radar systems
  • Satellite and cellular communications infrastructure
  • Power amplifiers
  • Low-noise blocks (LNBs), low-noise amplifiers (LNAs), low-noise converters (LNCs)
  • Aerospace and avionics
  • Ka-band, E-band, and W-band systems
  • Phased array antennas and RF filters/couplers

TLY TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK at 10 GHz IPC-650 2.5.5.5 2.2 2.2
Df at 10 GHz IPC-650 2.5.5.5 0.0009 0.0009
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Dielectric Strength ASTM D 149 V/mil 2,693 V/mil 106,023
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 1010 Mohms/cm 1010
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 1010 Mohms/cm 109
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 108 Mohms 108
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 108 Mohms 108
Flex Strength(MD) IPC-650 2.4.4 psi 14,057 N/mm2 96.91
Flex Strength(CD) IPC-650 2.4.4 psi 12,955 N/mm2 89.32
Peel Stength(½ oz.ed copper) IPC-650 2.4.8 Ibs./inch 11 N/mm 1.96
Peel Stength(1 oz.CL1 copper) IPC-650 2.4.8 Ibs./inch 16 N/mm 2.86
Peel Stength(1 oz..CV1 copper) IPC-650 2.4.8 Ibs./inch 17 N/mm 3.04
Peel Stength IPC-650 2.4.8(after elevated temp.) Ibs./inch 13 N/mm 2.32
Young's Modulus(MD) ASTM D 3039/IPC-650 2.4.19 psi 1.4 x 106 N/mm2 9.65 x 103
Poisson's Ratio(MD) ASTM D 3039/IPC-650 2.4.19 0.21 0.21
Thermal Conductivity ASTM F 433 W/M*K 0.22 W/M*K 0.22
Dimensional Stability(MD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.038 -0.038
Dimensional Stability(CD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.031 -0.031
Density(Specific Gravity) ASTM D 792 g/cm3 2.19 g/cm3 2.19
CTE(X axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 26 ppm/℃ 26
CTE(Y axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 15 ppm/℃ 15
CTE(Z axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 217 ppm/℃ 217
NASA Outgassing(% TML) 0.01 0.01
NASA Outgassing(% CVCM) 0.01 0.01
NASA Outgassing(% WVR) 0.00 0.00
UL-94 Flammability Rating UL-94 V-0 V-0

TLY-5 PCB Material Copper Clad Laminate

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Product Detail
Brand Name :
Bicheng
Model Number :
BIC-332.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Contact Supplier
TLY-5 PCB Material Copper Clad Laminate

Bicheng Electronics Technology Co., Ltd

Verified Supplier
6 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
RF PCB Board, Rogers PCB Board, PTFE PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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