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DiClad 527 PCB Substrate Copper Clad Laminate Sheet
DiClad 527 PCB Substrate Copper Clad Laminate Sheet
Specifications
Brand Name :
Bicheng
Model Number :
BIC-332.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Part number :
DiClad 527
Laminate thickness :
0.508mm 0.762mm 1.524mm
Laminate size :
12''X18''(305X457mm) 18''X12''(457X305)18''X 24''(475 X 610mm)24''X18''(610X457mm)
Copper weight :
0.5OZ(0.018MM), 1OZ（0.035mm);
Description

DiClad 527 laminates are woven fiberglass-reinforced PTFE composite materials engineered for use as high-performance printed circuit board (PCB) substrates. Through precise calibration of the fiberglass-to-PTFE ratio, DiClad 527 offers a versatile product range—spanning variants with ultra-low dielectric constant (Dk) and dissipation factor (Df), to highly reinforced grades optimized for enhanced dimensional stability.


The woven fiberglass reinforcement core to all DiClad series materials delivers superior dimensional stability when compared to nonwoven fiberglass-reinforced PTFE laminates of equivalent dielectric constant. Rogers’ stringent process control and consistency for PTFE-coated fiberglass cloth enable a broader spectrum of available Dk values, while also producing laminates with improved dielectric constant uniformity over comparable nonwoven fiberglass-reinforced alternatives. DiClad materials feature unidirectionally aligned coated fiberglass plies; cross-plied configurations of most grades are available under the CuClad product line.


DiClad 527 laminates are ideally suited for applications where dielectric constant uniformity is a critical performance parameter, including RF filters, couplers, and low-noise amplifiers (LNAs). They are also a high-value choice for power dividers and combiners, where minimal signal loss is paramount. With a dielectric constant (Er) range of 2.40–2.65, DiClad 527 utilizes a higher fiberglass-to-PTFE ratio to achieve mechanical performance that approaches conventional PCB substrates—alongside additional advantages of enhanced dimensional stability and reduced thermal expansion across all axes. The electrical properties of DiClad 527 laminates are validated through rigorous testing at 1 MHz and 10 GHz, respectively.

DiClad 527 PCB Substrate Copper Clad Laminate Sheet


Features & Benefits

  • Ultra-low loss tangent
  • Exceptional dimensional stability
  • Consistent product performance
  • Highly uniform electrical properties across the operating frequency range
  • Reliable, repeatable mechanical performance
  • Superior chemical resistance


Typical Applications

  • Military radar feed networks
  • Commercial phased array antenna networks
  • Low-loss base station antennas
  • Missile guidance systems
  • Digital radio antennas
  • RF filters, couplers, and low-noise amplifiers (LNAs)

Properties DiClad 527 Units Test Conditions Test Method
Electrical Properties - - - -
Dielectric Constant (10 GHz) 2.40-2.60 - 23˚C @ 50% RH 10 GHz IPC TM-650 [2.5.5.5](2.5.5.5)
Dielectric Constant (1 MHz) 2.40-2.60 - 23˚C @ 50% RH 1 MHz IPC TM-650 [2.5.5.3](2.5.5.3)
Dissipation Factor (10 GHz) 0.0017 - 23˚C @ 50% RH 10 GHz IPC TM-650 [2.5.5.5](2.5.5.5)
Dissipation Factor (1 MHz) 0.0010 - 23˚C @ 50% RH 1 MHz IPC TM-650 [2.5.5.3](2.5.5.3)
Thermal Coefficient of Dielectric Constant -153 ppm/˚C -10 to 140˚C 10 GHz IPC TM-650 [2.5.5.5](2.5.5.5)
Volume Resistivity 1.2 x 10⁹ MΩ-cm C96/35/90 IPC TM-650 [2.5.17.1](2.5.17.1)
Surface Resistivity 4.5 x 10⁷ MΩ C96/35/90 IPC TM-650 [2.5.17.1](2.5.17.1)
Dielectric Breakdown >45 kV D48/50 ASTM D-149
Arc Resistance >180 - - ASTM D-495
Thermal Properties - - - -
Coefficient of Thermal Expansion - x 14 ppm/˚C -50˚C to 150˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 21 ppm/˚C -50˚C to 150˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 173 ppm/˚C -50˚C to 150˚C IPC TM-650 2.4.24
Thermal Conductivity 0.26 W/(m.K) - ASTM E1461
Mechanical Properties - - - -
Copper Peel Strength 14 Lbs/in 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Young’s Modulus 517, 706 kpsi 23˚C @ 50% RH ASTM D-638
Tensile Strength (MD, CMD) 19.0, 15.0 kpsi 23˚C @ 50% RH ASTM D-882
Compressive Modulus 359 kpsi 23˚C @ 50% RH ASTM D-695
Flex Modulus 537 kpsi 23˚C @ 50% RH ASTM D-3039
Physical Properties - - - -
Flammability V-0 - C48/23/50 & C168/70 UL 94
Moisture Absorption 0.03 % E1/105+D24/23 IPC TM-650 [2.6.2.2](2.6.2.2)
Density 2.31 g/cm³ C24/23/50 Method A ASTM D792
NASA Outgassing - - - -
Total Mass Lost 0.02 % 125°C, ≤ 10⁻⁶ torr NASA SP-R-0022A
Collected Volatiles 0.00 % 125°C, ≤ 10⁻⁶ torr NASA SP-R-0022A
Water Vapor Recovered 0.01 % 125°C, ≤ 10⁻⁶ torr NASA SP-R-0022A

DiClad 527 PCB Substrate Copper Clad Laminate Sheet

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Product Detail
Brand Name :
Bicheng
Model Number :
BIC-332.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Contact Supplier
DiClad 527 PCB Substrate Copper Clad Laminate Sheet

Bicheng Electronics Technology Co., Ltd

Verified Supplier
6 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
RF PCB Board, Rogers PCB Board, PTFE PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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