Specifications
Brand Name :
Bicheng
Model Number :
BIC-332.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Part number :
IsoClad 933
Laminate thickness :
0.381mm 0.787mm 1.575mm
Laminate size :
305X460mm(12X18''); 24X18''(610X457mm)
Copper weight :
0.5OZ(0.018MM), 1OZ(0.035mm);
Description

IsoClad® 933 laminates are nonwoven fiberglass-reinforced PTFE composite materials tailored for deployment as printed circuit board (PCB) substrates. The nonwoven reinforcement architecture imparts enhanced flexural capability, making these laminates ideally suited for applications requiring post-fabrication circuit bending—conformal or “wrap-around” antennas represent a prime use case for this attribute.


Unlike standard nonwoven fiberglass/PTFE alternatives, IsoClad series laminates incorporate longer randomly oriented fibers and leverage a proprietary manufacturing process to deliver superior dimensional stability and enhanced dielectric constant (Dk) uniformity, even when compared to competitive products with equivalent dielectric constant values.


With a dielectric constant (Er) of 2.33, IsoClad 933 laminates utilize a higher fiberglass-to-PTFE ratio to form a highly reinforced composite structure. This optimized formulation achieves improved dimensional stability alongside elevated mechanical strength, without compromising core electrical performance.

IsoClad 933 PCB Substrate Copper Clad Laminate Sheet


Features

  • Nonwoven fiberglass reinforcement
  • Low dielectric constant (Er = 2.33)
  • Ultra-low signal loss


Benefits

  • Reduced rigidity versus woven fiberglass-reinforced laminates
  • Exceptional isotropy across the X, Y, and Z axes


Typical Applications

  • Conformal antennas
  • Stripline and microstrip circuits
  • Missile guidance systems
  • Radar and electronic warfare systems

Property Test Method Condition IsoClad 933
Dielectric Constant @ 10 GHz IPC TM-650 2.5.5.5 C23/50 2.33
Dissipation Factor @ 10 GHz IPC TM-650 2.5.5.5 C23/50 0.0016
Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5 (Adapted) -10°C to +140°C -132
Peel Strength (lbs.per inch) IPC TM-650 2.4.8 After Thermal 10
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 3.5 x 10⁸
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 1.0 x 10⁸
Arc Resistance (seconds) ASTM D-495 D48/50 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23°C 173, 147
Tensile Strength (kpsi) ASTM D-882 A, 23°C 6.8, 5.3
Compressive Modulus (kpsi) ASTM D-695 A, 23°C 197
Flexural Modulus (kpsi) ASTM D-790 A, 23°C 239
Dielectric Breakdown (kV) ASTM D-149 D48/50 >45
Density (g/cm³) ASTM D-792 (Method A) A, 23°C 2.27
Water Absorption (%) MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2 E1/105 + D24/23 0.05
Coefficient of Thermal Expansion (ppm/°C) IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer 0°C to 100°C X Axis: 31
Y Axis: 47 Y Axis: 35
Z Axis: 236 Z Axis: 203
Thermal Conductivity (W/mK) ASTM E-1225 100°C 0.263
Outgassing Requirements 125°C, ≤10⁻⁶ torr -
Total Mass Loss (%) Maximum 1.00% 125°C, ≤10⁻⁶ torr 0.03
Collected Volatile Condensable Material (%) Maximum 0.10% 125°C, ≤10⁻⁶ torr 0.00
Water Vapor Regain (%) - 125°C, ≤10⁻⁶ torr 0.02
Visible Condensate ± 125°C, ≤10⁻⁶ torr NO
Flammability UL 94 Vertical Burn; IPC TM-650 2.3.10 C48/23/50, E24/125 Meets requirements of UL94-V0

IsoClad 933 PCB Substrate Copper Clad Laminate Sheet

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IsoClad 933 PCB Substrate Copper Clad Laminate Sheet

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Brand Name :
Bicheng
Model Number :
BIC-332.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Contact Supplier
IsoClad 933 PCB Substrate Copper Clad Laminate Sheet

Bicheng Electronics Technology Co., Ltd

Verified Supplier
6 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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