XT-FPCB Custom Flexible Printed Circuit Board Developed for Compact High-precision and Dynamic Bending Electronic Systems
Product Features:
- Superior Flexibility & Bending Durability: Made of high-quality PI flexible substrate, supporting long-term repeated dynamic bending and folding. It maintains stable circuit conduction without cracking or open circuit, adapting to frequent bending and rotating working scenarios.
- Ultra-Thin & Lightweight Design: Adopts ultra-thin circuit structure design, effectively reducing product volume and weight. It greatly improves space utilization, perfectly matching the miniaturization and lightweight development trend of modern electronic equipment.
- High-Density Wiring Capability: Supports fine line width and line spacing processing, realizing high-precision and high-density circuit layout in limited area. It can integrate complex circuit functions and meet the wiring requirements of precision intelligent devices.
- Excellent Environmental Stability: Features outstanding heat resistance, moisture resistance and chemical corrosion resistance. It works stably in a wide temperature range and humid environment, with low performance attenuation and strong anti-aging ability.
- Good Shock & Vibration Resistance: The flexible structure can effectively buffer external vibration and impact forces, avoid circuit damage caused by mechanical stress, and improve the overall anti-fall and anti-vibration performance of electronic equipment.
- Easy Assembly & Strong Compatibility: Supports SMT surface mounting and plug-in assembly, compatible with mainstream electronic assembly processes. It can be customized in size, shape and wiring according to customer requirements, with high flexibility of structural adaptation.
- Reliable Electrical Performance: Adopts high-purity copper foil conductive layer with low impedance and stable signal transmission. It effectively avoids signal interference and loss, ensuring high-precision and low-noise circuit operation.
Product Applications:
XT-FPCB flexible printed circuit boards are widely used in various electronic equipment that require flexible wiring, miniaturized installation and dynamic bending, covering consumer electronics, industrial intelligence, new energy and automotive electronics industries. The main application scenarios are as follows:
- Consumer Wearable Electronics: Internal circuit connection for smart watches, fitness trackers, TWS earbuds and wearable monitoring devices, adapting to body fitting and frequent bending use.
- Smart Mobile Devices: Flexible wiring for mobile phone camera modules, fingerprint recognition modules, folding screen components and internal connecting circuits of tablet computers.
- Industrial Intelligent Equipment: Circuit connection for industrial sensors, automated detection modules, robotic flexible joints and portable industrial testing instruments.
- New Energy & Automotive Electronics: Internal wiring for new energy vehicle control modules, battery management systems, on-board display screens and automotive sensing equipment.
- Medical Precision Equipment: Flexible circuit connection for portable medical detectors, wearable medical monitoring devices and miniature medical sensing modules.
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Parameter Category
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Specific Parameters
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Technical Specifications
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Structural Parameters
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Substrate Material
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High-purity PI (Polyimide)
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Copper Foil Type
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Electrolytic Copper / Rolled Copper
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Board Thickness
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0.06mm - 0.3mm (Customizable)
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Layer Count
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1-4 Layers (Customizable)
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Surface Treatment
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Gold Plating / Tin Spraying / Solder Mask
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Precision Parameters
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Minimum Line Width
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0.05mm
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Minimum Line Spacing
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0.05mm
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Minimum Aperture
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0.1mm
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Positioning Accuracy
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±0.03mm
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Electrical Parameters
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Rated Voltage
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300V
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Dielectric Strength
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≥5kV/mm
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Insulation Resistance
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≥10¹² Ω
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Maximum Current Load
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3A (0.1mm copper foil)
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Environmental Parameters
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Operating Temperature Range
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-40°C ~ +125°C
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Storage Temperature
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-20°C ~ +60°C
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Operating Humidity
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0-90% RH (Non-condensing)
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Bending Life
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≥100,000 times (standard bending radius)
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Reliability Parameters
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Solder Resistance Temperature
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260°C (10s transient resistance)
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Peel Strength
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≥1.2 N/mm
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