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AI+ Intelligent Busway System with Molecular-Shield Integral Molding, 8.2 MPa Bond Strength, and Partial Discharge ≤ 5 pC for AI Data Centers
AI+ Intelligent Busway System with Molecular-Shield Integral Molding, 8.2 MPa Bond Strength, and Partial Discharge ≤ 5 pC for AI Data Centers
AI+ Intelligent Busway System with Molecular-Shield Integral Molding, 8.2 MPa Bond Strength, and Partial Discharge ≤ 5 pC for AI Data Centers
AI+ Intelligent Busway System with Molecular-Shield Integral Molding, 8.2 MPa Bond Strength, and Partial Discharge ≤ 5 pC for AI Data Centers
Specifications
Model Number :
AI+IB-PD5
Packaging Details :
Wooden Box
Power-Frequency Withstand :
8 kV (no breakdown)
MOQ :
188 Meters
Protection Grade :
IP68
Certification :
ISO 9001/UL/IEC/CNAS/CMA
Temperature Rise :
≤ 30 K at full load
Operating Temperature :
-20°C to +60°C
Payment Terms :
T/T
Rated Voltage :
AC 690V
Insulation Technology :
Molecular-Shield integral molded solid insulation
Delivery Time :
Depends On Total Quantity
Brand Name :
ohory
Bond Strength :
8.2 MPa (insulation to conductor)
Place of Origin :
Guangdong, China
Price :
Negotiable
Supply Ability :
1500 Meters Per Day
Partial Discharge :
≤ 5 pC
Application :
AI data centers, GPU clusters, HPC, 100kW-class high-density racks, UPS output to rack rows
Rated Current :
1,250A - 6,300A
Description
AI+ Intelligent Busway System Low Partial Discharge 5pC Insulation High Bond Strength For AI Data Center Reliability
Product Overview

AI+ Intelligent Busway System with Molecular-Shield Low Partial Discharge Insulation

Insulation determines how safely an AI data center busway performs under decades of high load. This AI+ intelligent busway uses Molecular-Shield integral molded solid insulation, formed continuously and seamlessly on the conductor, achieving partial discharge below 5pC, 8kV power-frequency withstand and 8.2MPa insulation-to-conductor bond strength.

Core Advantages
  • Partial Discharge ≤ 5pC: Minimal discharge activity reduces long-term erosion of insulation under high voltage stress.
  • 8.2 MPa Bond Strength: Stable insulation-to-conductor bonding reduces delamination and aging risk over the product lifetime.
  • Seamless Integral Molding: No wrapping joints, overlaps or edge seals means fewer localized weak points and moisture paths.
  • Consistent Batch Quality: Controlled molding thickness and coverage reduce dependence on manual wrapping technique.
Technical Specifications
Parameter Value
Partial Discharge ≤ 5 pC
Power-Frequency Withstand 8 kV (no breakdown)
Bond Strength 8.2 MPa (insulation to conductor)
Rated Current 1,250A - 6,300A
Rated Voltage AC 690V
Temperature Rise ≤ 30 K at full load
Protection Grade IP68
Operating Temperature -20°C to +60°C
Insulation Technology Molecular-Shield integral molded solid insulation
Applications
  • AI data centers and AI computing power centers
  • GPU clusters and HPC computing halls
  • 100kW-class high-density server racks
  • UPS output to high-density rack row power distribution
Quality & Service

Manufactured under ISO 9001 quality management with UL/IEC/CNAS/CMA certified testing. Intelligent busway system delivered with monitoring platform access, installation guidance and technical documentation. OEM and ODM support available.

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AI+ Intelligent Busway System with Molecular-Shield Integral Molding, 8.2 MPa Bond Strength, and Partial Discharge ≤ 5 pC for AI Data Centers

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Product Detail
Model Number :
AI+IB-PD5
Packaging Details :
Wooden Box
Power-Frequency Withstand :
8 kV (no breakdown)
MOQ :
188 Meters
Protection Grade :
IP68
Certification :
ISO 9001/UL/IEC/CNAS/CMA
Contact Supplier
AI+ Intelligent Busway System with Molecular-Shield Integral Molding, 8.2 MPa Bond Strength, and Partial Discharge ≤ 5 pC for AI Data Centers
AI+ Intelligent Busway System with Molecular-Shield Integral Molding, 8.2 MPa Bond Strength, and Partial Discharge ≤ 5 pC for AI Data Centers

DONGGUAN OHORY ELECTRIC TECHNOLOGY CO.,LTD

Verified Supplier
3 Years
guangdong, dongguan
Since 2015
Business Type :
Manufacturer, Exporter
Main Products :
Electric Busway, Polycarbonate Insulation Films, Flame Retardant Silicone Foam
Total Annual :
800000-1000000
Employee Number :
100~200
Certification Level :
Verified Supplier
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