FR4 solder-masked 6-layer board PCB

A 6-layer FR4 solder mask PCB is a multilayer printed circuit board (PCB) based on an FR4 substrate and including its solder mask layer. Designed for complex electronic designs, this PCB consists of six layers, typically consisting of an outer copper foil layer, an inner signal layer, an inner copper foil layer, and a substrate layer. FR4 acts as an insulating core material, providing mechanical strength and electrical performance. A solder mask (usually green) covers the copper layer to prevent short circuits and oxidation, leaving only the solder pads for soldering.

Advantages of Multilayer PCB:

Product Features:

• Multi-layer design
• Inner layer and outer layer
• through hole
• Copper layer
• Dielectric layer (dielectric material)

Manufacturing process:

• Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
• Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
• Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
• Etching: On each layer of the circuit, use photolithography and etching techniques to form the circuit pattern, removing excess copper foil
• Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).