8 layers of Black Oil Sinking Gold Thick Copper Plate PCB

An 8-layer black solder mask immersion gold PCB is a high-density integrated circuit board composed of 8 copper circuit layers separated by insulating prepreg, bonded via high-temperature and high-pressure lamination. Its surface is coated with a black solder mask layer to protect copper traces from oxidation and corrosion, while the immersion gold finish ensures excellent solderability, electrical conductivity and anti-tarnish performance. Vias (through, blind, buried) realize reliable interlayer connections.

Core Advantages of Black Solder Mask Immersion Gold Multilayer PCBs vs. Conventional PCBs

Standardized Requirements for the Customization of Multi-layer PCB

Send us your:
1. Gerber files (RS-274X)
2. BOM (if PCBA needed)
3. Impedance requirements & stack-up (if available)
4.Test requirements (TDR, network analyzer, etc.)

Tip:Normally,Gerber files includes: PCB type,thickness, ink color, surface treatment process, and if SMT processing is required, you can provide a component BOM and reference designation diagram, etc.

We’ll reply within 24 hours with a free quote, DFM report, and material recommendation.

Production Process of Black Solder Mask Immersion Gold Multilayer PCBs
1. Fabricate inner circuit layers, inspect defects via AOI, then stack and laminate with prepreg under high temperature and pressure.
2. Drill through/blind/buried vias, plate copper on via walls and surfaces to ensure interlayer conductivity.
3. Transfer and etch outer circuit patterns, then apply black solder mask and cure it.
4. Perform immersion gold finish on pad areas to enhance solderability and corrosion resistance.
5. Conduct electrical testing (e.g., flying probe test) and shape cutting before final quality inspection.

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