FR4 solderable 4-layer board PCB
Product Description:
Multilayer printed circuit boards (PCB) are a common type of circuit board in modern electronic devices. They consist of multiple single-sided or double-sided circuit boards stacked together with insulating materials in between, forming a single unit. Each layer of circuits is composed of different circuit layers, and these layers are connected together through vias or interconnecting lines. Compared with single-sided and double-sided PCBs, multi-layer PCBs can achieve more circuit wiring in a smaller space and are suitable for more complex and function-intensive circuit designs.
Advantages of Multilayer PCB:
- High Density
- Improved Signal Integrity
- Better Electromagnetic Compatibility (EMC)
- Adapt to high-frequency applications
- Better thermal management
- Complexity and Cost
Applications:
• Telecommunications
• Computers
• Automotive electronics
• Medical devices
• Consumer electronics
• Aerospace
• Industrial control
Manufacturing process:
- Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
- Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
- Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
- Etching: On each layer of the circuit, use photolithography and etching techniques to form the circuit pattern, removing excess copper foil
- Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).