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3mil Line Space HDI PCB with Microvias and High Tg FR-4 Substrate for High-Density Interconnect Applications
3mil Line Space HDI PCB with Microvias and High Tg FR-4 Substrate for High-Density Interconnect Applications
Specifications
Brand Name :
Xingqiang
Model Number :
As Per Customer's Model
Place Of Origin :
China
Certification :
ISO 9001 / RoHS /UL / IATF 16949 (automotive)
MOQ :
Sample,1 Pc(5 Square Meters)
Price :
Based on Gerber Files
Packaging Details :
Packed As Per Customer
Payment Terms :
,T/T,Western Union
Supply Ability :
100000㎡/Month
Delivery Time :
NA
Product Name :
High Density Interconnect PCB
Minimum Line Space :
3mil (0.075mm)
Substrate :
High Tg FR-4
PCB Layers :
2/4/6/8/10L
PCBA Customization :
Suppport
Surface Finishing :
OSP/ENIG/ENEPIG
PCB Standard :
IPC-A-610 E Class II
SMT :
SMD, BGA, DIP, Etc.
Quotation Info :
Gerber or BOM List
Board Thinkness :
1.2/1.6/1.0/0.8mm or Customized
Description
HDI Printed Board Delivering Electrical Connections And Miniaturized Layouts
High-Performance HDI PCBs for Modern Electronics

This product incorporates Microvias, Blind Vias, and Buried Vias, ensuring efficient and precise interconnections within the multilayer structure. These via types play a crucial role in enhancing the overall functionality and reliability of the board by minimizing signal loss and crosstalk, which are critical factors in high-speed and high-frequency circuits.

The High Density Interconnect PCB is manufactured using high-quality FR4 material, renowned for its excellent mechanical strength, thermal stability, and electrical insulation properties. FR4 is a widely accepted standard in the printed circuit board industry, making this High Density Interconnection Board not only durable but also cost-effective. The choice of material ensures that the board can withstand harsh environmental conditions while maintaining optimal performance, making it suitable for applications in telecommunications, aerospace, medical devices, and consumer electronics.

Main Features
Feature Category Key Characteristics (HDI PCB)
Design & Structure Microvias, high layer count integration, dense component placement, thin substrate
Performance Low signal loss, high-speed transmission support, excellent thermal conductivity, stable impedance
Manufacturing Process Laser drilling, sequential lamination, precise registration control, advanced plating tech
Application Advantages Miniaturization enablement, weight reduction, enhanced reliability for compact electronics
Technical Specifications Fine line width/spacing (≤3mil/3mil), microvia diameter (≤0.15mm), high aspect ratio capability
Applications
  • Consumer Electronics: Smartphones, tablets, laptops, smartwatches, TWS earbuds, cameras, game consoles
  • Communication Devices: 5G base stations, routers, switches, optical modules, satellite communication equipment, IoT gateways
  • Automotive Electronics: Car navigation systems, autonomous driving sensors (radar/cameras), infotainment systems, EV BMS
  • Medical Devices: Portable blood glucose meters, ECG machines, ultrasound scanners, wearable medical devices, patient monitors
  • Industrial Electronics: Industrial robots, PLCs, sensor modules, automated control equipment
  • Aerospace: Satellite payloads, avionics control systems, UAV core components
  • Other High-End Gear: AR/VR devices, high-end servers, SSDs, laser printer core modules
Product Showcase
3mil Line Space HDI PCB with Microvias and High Tg FR-4 Substrate for High-Density Interconnect Applications
Factory showcase
3mil Line Space HDI PCB with Microvias and High Tg FR-4 Substrate for High-Density Interconnect Applications
PCB Quality Testing
3mil Line Space HDI PCB with Microvias and High Tg FR-4 Substrate for High-Density Interconnect Applications
3mil Line Space HDI PCB with Microvias and High Tg FR-4 Substrate for High-Density Interconnect Applications
Certificates and Honors
3mil Line Space HDI PCB with Microvias and High Tg FR-4 Substrate for High-Density Interconnect Applications
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3mil Line Space HDI PCB with Microvias and High Tg FR-4 Substrate for High-Density Interconnect Applications

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Product Detail
Brand Name :
Xingqiang
Model Number :
As Per Customer's Model
Place Of Origin :
China
Certification :
ISO 9001 / RoHS /UL / IATF 16949 (automotive)
MOQ :
Sample,1 Pc(5 Square Meters)
Price :
Based on Gerber Files
Contact Supplier
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3mil Line Space HDI PCB with Microvias and High Tg FR-4 Substrate for High-Density Interconnect Applications

Dongguan Xingqiang Circuit Board Technology Co., Ltd.

Verified Supplier
2 Years
guangdong, dongguan
Since 1995
Business Type :
Manufacturer
Main Products :
Multilayer PCB Board, Flexible PCB Board, Double Sided PCB
Total Annual :
80000000-84000000
Employee Number :
500~800
Certification Level :
Verified Supplier
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