Specifications
Brand Name :
xingqiang
Model Number :
As Per Customer's Model
Certification :
ISO 9001 / RoHS /UL / IATF 16949 (automotive)
Place of Origin :
China
MOQ :
Sample,1 pc(5 square meters)
Price :
Based on Gerber Files
Payment Terms :
,T/T,Western Union
Supply Ability :
100000㎡/Month
Delivery Time :
NA
Product :
HDI Print Circuit Board
Min. hole Size :
0.1mm
Materila :
High Tg FR-4
Pcba Standard :
IPC-A-610E
Minimum Line Space :
3mil (0.075mm)
Measurement :
Customized
Surface Finishing :
OSP/ENIG/ ENEPIG
Production Request :
Gerber Files or BOM List
Oil color :
Black,Red,Yellow,White,Blue
Regular Thickness :
1.6/1.2/1.0/0.8mm or Customized
Description

HDI PCBs: The Ideal Choice for High-Speed High-Frequency Applications


HDI PCB (High-Density Interconnect Printed Circuit Board) is a high-performance circuit board with higher connection density, smaller microvias, and finer line widths than traditional PCBs. It uses blind, buried, and stacked vias to save space, supports miniaturized electronic devices, and ensures excellent signal transmission for high-speed, high-frequency applications.



Core Manufacturing Challenges

  1. Ultra-fine Line and Space Fabrication :HDI boards require line widths and spaces (L/S) as small as 25μm/25μm or even finer. Controlling undercutting, line discontinuity, and copper uniformity during etching is extremely difficult, as minor process variations can lead to open or short circuits.
  2. High-Precision Drilling for Microvias: Microvias (typically ≤150μm in diameter) demand advanced laser drilling or mechanical micro-drilling techniques. Issues like drill breakage, uneven hole walls, and thermal damage to the substrate (especially for laser drilling) are major hurdles, directly affecting interconnection quality.
  3. Layer-to-Layer Alignment Accuracy : Multiple stacked layers (often ≥8 layers) require precise alignment, with registration tolerances as tight as ±10μm. Any misalignment between layers can cause microvia misconnection, reducing yield and board reliability.
  4. Reliability Control of Stacked/Buried Vias: Stacked or buried microvias need consistent plating thickness (usually ≥20μm) to ensure conductivity and mechanical strength. Voids, poor adhesion, or uneven plating within vias can lead to premature failure under thermal cycling or vibration.
  5. Surface Finish and Solderability: Fine-pitch components (e.g., 01005 chips or CSPs) on HDI boards require uniform surface finishes (e.g., ENIG, Immersion Silver). Controlling finish thickness, avoiding oxidation, and ensuring solder joint reliability are critical, as small defects can cause soldering failures.


FAQ:

1.Q:Why choose HDI Printed Circuit Board?

A:HDI PCBs are the optimal choice because their blind, buried, and stacked vias save valuable space, while their advanced design supports miniaturized electronics and delivers excellent high-speed, high-frequency signal performance.

2.Q:How many layers can your circuit boards provide?

A:We typically provide 1-30 layer boards, and in special cases, we can stack more layers.

3. Q:Do your circuit boards support customization?

A:Yes, we support customized designs. You can send us your Gerber files and BOM list, and we will provide you with an accurate quote based on the information and market conditions.

4. Q:What do Gerber files typically contain?

A:Normally Gerber files Include:PCB Types,Product thickness, Ink color, Surface treatment process and If SMT processing is required, component BOM and tag drawing are also required.
5. Q:What is your minimum order quantity for PCB boards?

A:Our minimum order quantity is 1 piece(5 square meters),the larger the quantity, the bigger the discount.

6. Q:Do you have relevant certification certificates to support this?

A:We hold numerous important certifications, including ISO, UL, CE, and RoHS. All products undergo rigorous quality testing.

7. Q:What payment method do you usually use?

A:For small orders, samples, or urgent payments, we accept Western Union. For large orders, we recommend T/T, which ensures the safety of both parties.


4 Layer Black Oil  Solder Mask HDI PCB Circuit Board Laser Drilling Process

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4 Layer Black Oil  Solder Mask HDI PCB Circuit Board Laser Drilling Process


PCB Quality Testing


4 Layer Black Oil  Solder Mask HDI PCB Circuit Board Laser Drilling Process


Certificates and Honors

4 Layer Black Oil  Solder Mask HDI PCB Circuit Board Laser Drilling Process



4 Layer Black Oil  Solder Mask HDI PCB Circuit Board Laser Drilling Process

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4 Layer Black Oil Solder Mask HDI PCB Circuit Board Laser Drilling Process

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Brand Name :
xingqiang
Model Number :
As Per Customer's Model
Certification :
ISO 9001 / RoHS /UL / IATF 16949 (automotive)
Place of Origin :
China
MOQ :
Sample,1 pc(5 square meters)
Price :
Based on Gerber Files
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video
4 Layer Black Oil  Solder Mask HDI PCB Circuit Board Laser Drilling Process

Dongguan Xingqiang Circuit Board Technology Co., Ltd.

Verified Supplier
2 Years
guangdong, dongguan
Since 1995
Business Type :
Manufacturer
Total Annual :
80000000-84000000
Employee Number :
500~800
Certification Level :
Verified Supplier
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