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Custom Multilayer PCB with 1-30 Layers, Blind And Buried Vias, and IPC Class 2 Compliance for High Density Interconnect Applications
Custom Multilayer PCB with 1-30 Layers, Blind And Buried Vias, and IPC Class 2 Compliance for High Density Interconnect Applications
Specifications
Brand Name :
Xingqiang
Model Number :
As Per Customer's Model
Place Of Origin :
China
Certification :
ISO 9001 / ROHS /UL / IATF 16949 (automotive)
MOQ :
Sample,1 Pc(5 Square Meters)
Price :
Based On Gerber Files
Packaging Details :
Packed As Per Customer
Delivery Time :
NA
Payment Terms :
,T/T,Western Union
Supply Ability :
100000㎡/Month
Productname :
High Density Interconnect PCB
Pcba Customization :
Suppport
Copper Overall :
0.5-5oz
Max Layer Count :
1-30 Layers
Special Thickness :
0.6/0.4/0.2mm
Feature :
Blind And Buried Vias
Silkscreen :
White, Black, Yellow
Production Request :
Gerber Files Or BOM List
Standard :
IPC Class 2 Compliance
Regular Thickness :
1.6/1.2/1.0/0.8mm Or Customized
Description
Custom Multilayer PCB Manufacturing High Frequency RF Circuit Board OEM/ODM Service
Premium Multi-Layer PCB Ensuring Long-Term Stability & Signal Integrity
This high-precision multi-layer PCB is designed for high-reliability electronic systems. It features immersion gold (ENIG) surface treatment on all contacts and gold finger connectors, ensuring superior solderability, long-term oxidation resistance, and stable signal transmission. The board's compact, high-density layout supports fine-pitch components like BGA/QFN, making it ideal for applications such as 5G communication modules, industrial control, automotive ADAS, and IoT devices. Built with rigorous process control to avoid defects like "black pads," it delivers consistent performance across multiple reflows and frequent insertion/extraction cycles.
Core Advantages of Custom Multilayer PCB
  • High stability and reliability, suitable for long-term operation in various working environments
  • Excellent electrical performance, supporting precise impedance control and high-speed signal transmission
  • Good heat dissipation performance, effectively reducing temperature rise during operation
  • High processing precision, with fine line width and aperture, meeting high-density assembly requirements
  • Multiple surface finishing options available, ensuring strong solderability and long service life
  • Compatible with lead-free and RoHS compliant processes, environmentally friendly and safe
  • High structural strength, low warpage, suitable for automatic assembly and mass production
  • Wide application compatibility, ideal for consumer electronics, industrial control, communications and automotive fields
Frequently Asked Questions
Q: How many layers can your circuit boards provide?
A: We generally provide 1-30 layer PCBs. Higher layer counts can be customized for special requirements.
Q: Do your circuit boards support customization?
A: Yes, we support fully customized designs. You can send us your Gerber files and BOM list, and we will provide an accurate quotation based on your requirements and current market conditions.
Q: What information is typically included in Gerber files?
A: Gerber files usually specify PCB type, board thickness, solder mask color, surface treatment, etc. If SMT assembly is required, BOM and component placement files are also needed.
Q: What is your minimum order quantity for PCBs?
A: Our MOQ is 1 piece (5 square meters). Larger order quantities will be eligible for better discounts.
Q: Do you have relevant certifications?
A: Yes, we possess authoritative certifications including ISO, UL, CE, and RoHS. All products are inspected through strict quality control procedures.
Q: What payment methods do you accept?
A: Western Union is available for small orders, samples, and urgent payments. For bulk orders, we recommend T/T, which is safer and more reliable for both parties.
Custom Multilayer PCB with 1-30 Layers, Blind And Buried Vias, and IPC Class 2 Compliance for High Density Interconnect Applications
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Custom Multilayer PCB with 1-30 Layers, Blind And Buried Vias, and IPC Class 2 Compliance for High Density Interconnect Applications
PCB Quality Testing
Custom Multilayer PCB with 1-30 Layers, Blind And Buried Vias, and IPC Class 2 Compliance for High Density Interconnect Applications
Certificates and Honors
Custom Multilayer PCB with 1-30 Layers, Blind And Buried Vias, and IPC Class 2 Compliance for High Density Interconnect Applications
Custom Multilayer PCB with 1-30 Layers, Blind And Buried Vias, and IPC Class 2 Compliance for High Density Interconnect Applications
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Custom Multilayer PCB with 1-30 Layers, Blind And Buried Vias, and IPC Class 2 Compliance for High Density Interconnect Applications

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Product Detail
Brand Name :
Xingqiang
Model Number :
As Per Customer's Model
Place Of Origin :
China
Certification :
ISO 9001 / ROHS /UL / IATF 16949 (automotive)
MOQ :
Sample,1 Pc(5 Square Meters)
Price :
Based On Gerber Files
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Custom Multilayer PCB with 1-30 Layers, Blind And Buried Vias, and IPC Class 2 Compliance for High Density Interconnect Applications

Dongguan Xingqiang Circuit Board Technology Co., Ltd.

Verified Supplier
2 Years
guangdong, dongguan
Since 1995
Business Type :
Manufacturer
Main Products :
Multilayer PCB Board, Flexible PCB Board, Double Sided PCB
Total Annual :
80000000-84000000
Employee Number :
500~800
Certification Level :
Verified Supplier
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