We provide professional custom HDI PCB manufacturing for mobile and smart device manufacturers. Our 6–10 layer boards use high-Tg FR4 substrate and ENIG surface treatment for enhanced reliability and performance. With strict AOI, electrical testing, and quality control, we ensure consistent production. Compliant with international certifications, we offer DFM analysis, rapid prototyping, and mass production to meet your project requirements.
| Parameter | Details |
|---|---|
| PCB Type | Custom HDI Multilayer PCB |
| Base Material | High-Tg FR4 (Tg ≥ 140°C) |
| Surface Finish | ENIG (Immersion Gold) |
| Layer Count | 6-10 Layers (Standard: 8L) |
| Copper Thickness | 1oz (Inner), 1oz (Outer) |
| Via Technology | Microvias, Blind & Buried Vias |
| Line Width/Spacing | 3mil / 3mil (Fine Pitch Capability) |
| Certifications | RoHS, ISO 9001 |
| Application | Custom Smartphone Mainboards, Portable Terminals |
• Complete Gerber files including circuit layers, outline, solder mask and silkscreen
• Standard NC drill files for all via and hole data
• BOM list with component specifications if assembly is required
• Schematic diagram for engineering reference
• Clear requirements: layer count, surface finish, thickness, tolerance and IPC standard

Factory showcase

PCB Quality Testing

Certificates and Honors

