Primarily designed for binder burning out (BBO) under oxygen-free processes for electronic components and ceramic substrates.
Rated Temperature: 200ºC
Maximum Temperature: 300ºC
Effective Dimensions: 800 × 800 × 800mm (W×H×D)
Heating Method: Customized Heater
Process Atmosphere: Nitrogen
Temperature Control Stability: ±1ºC with PID parameter self-tuning
Temperature Uniformity: ±3ºC (after 1 hour insulation at 200ºC)
Thermocouple: Type K
Temperature Control Points: 1
Temperature Monitoring Points: 1
Process Steps: 20 steps
Exhaust System: Top-mounted exhaust port
Alarm System: Sound and light alarms for over-temperature and thermocouple failure
Maximum Heating Power: 10kW
Insulation Power: ≤ 5kW
Surface Temperature Rise: ≤ 35ºC
Weight: Approximately 700kg
Furnace Dimensions: 1550×1630×1050mm (W×H×D)
Appearance Color: Light gray
Environmental conditions: Temperature 0-40ºC, humidity ≤80% RH, no corrosive gas, no strong airflow disturbance
Process air conditions: 99.999% purity nitrogen, pressure 0.2-0.4Mpa, gas consumption 5-15m³/h
Ventilation system: Non-contact access to user pumping system with capacity >15m³/h
Ground requirements: Level surface, no vibration, bearing capacity >300Kg/m²
Power conditions: >14kVA capacity, 3-phase 5-wire, 220/380V, 50Hz
Installation space: 2500mm×2100mm×3000mm (W×H×D), area >5m²