Inline Visual Dispensing Machine for Wire Bonding Gold Wire Encapsulation

The GS600M Inline Visual Dispensing Machine is a precision-engineered inline dispensing solution designed to meet the ultra-high requirements of gold wire encapsulation in advanced wire bonding applications.

Equipped with a high-resolution visual alignment system, the GS600M detects fine wire positions and calculates optimal dispensing paths in real time. Its advanced low-level alarm module prevents unexpected interruptions by monitoring fluid levels and ensuring consistent glue supply throughout production.

The GS600M supports both single-valve micro-dispensing for precise adhesive control and double-valve configurations for higher throughput where needed. Its rigid mineral cast frame minimizes vibration, maintaining stable, consistent performance in high-volume wire bonding lines.

Key Advantages

• Ultra-Precise KOZ Control: Guarantee accurate glue placement within a 10μm tolerance, safeguarding gold wire loops and preventing accidental bending or damage.

• Consistent, Even Glue Dispensing: Advanced valve control and visual inspection ensure every encapsulation is uniform, preventing underfill or overflow that could compromise wire integrity.

• Real-Time Visual Positioning: Integrated mark recognition and product appearance alignment enable adaptive path correction for complex wire patterns.

• Low-Level Alarm Module: Proactively alerts operators when adhesive supply is low, minimizing downtime and avoiding incomplete encapsulations.

Typical Applications

✔ Gold Wire Encapsulation for Wire Bonding
✔ KOZ-Controlled Underfill for Semiconductor Packaging
✔ Fine-Pitch Die Attach Encapsulation
✔ ASIC and MEMS Chip Bonding Protection
✔ SMD Reinforcement and Potting
✔ Micro Sensor Wire Loop Protection

Key Specifications

FAQ

Q1: Why is KOZ control so critical for wire bonding?
A: Any glue overflow or misplacement can damage fine gold wires or cause electrical shorts. The GS600 series’s KOZ control ensures glue stays exactly where needed, protecting bond loops.

Q2: Can the GS600 series be used with UV-curable adhesives?
A: Yes. The system is compatible with a wide range of adhesives, including UV, epoxy, and underfill materials commonly used in semiconductor wire bonding.

Q3: Does the machine support high-mix production?
A: Absolutely. The system’s flexible configuration and recipe management allow fast model changeover, ideal for varied product runs.

Q4: How does it prevent whole line downtime?
A: Each track operates independently, and the conveyor track design separates maintenance areas — minimizing unplanned stops for the entire line.

Conclusion

Achieve unmatched precision, protect your gold wires, and meet the toughest encapsulation requirements — choose the GS600M for wire bonding encapsulation that sets your production apart.

Contact us for a custom demo and unlock next-level precision for your packaging line!