Specifications
Surface Finish Options :
HASL, ENIG, OSP, Immersion Tin, Immersion Silver
Operating Temperature :
-20°C to +130°C
Brand Name :
Jiaqing Circuit
Thermal Conductivity :
Enhanced via copper mass
Certification :
ISO9001
Delivery Time :
15-30 Days
Layer Count :
1 – 10 layers
Place of Origin :
China
Price :
negotiate
Payment Terms :
L/C,D/A,D/P,T/T
Description

This Blind and Buried Via PCB enables higher routing density than traditional through-hole boards by utilizing vias that connect only specific layers. Blind vias connect outer layers to one or more inner layers without penetrating the full board, while buried vias connect inner layers without reaching the surface. This technology conserves board space, allows for more compact designs, and improves signal integrity by reducing parasitic capacitance and inductance. Available in 4-10 layer configurations with sequential lamination, these boards are ideal for advanced consumer electronics, telecommunications, and medical devices.

Applications & Advantages by Category
  • Smartphones & Tablets – Blind and buried via technology enables compact motherboards with high component density.
  • Telecommunications Equipment – Dense routing for routers, switches, and networking gear.
  • Medical Devices – High-density interconnect for miniaturized implantable and portable medical electronics.
  • Industrial Controls – Board space optimization for compact control systems.
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Blind and Buried Via PCB for High Density Interconnect Applications

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Surface Finish Options :
HASL, ENIG, OSP, Immersion Tin, Immersion Silver
Operating Temperature :
-20°C to +130°C
Brand Name :
Jiaqing Circuit
Thermal Conductivity :
Enhanced via copper mass
Certification :
ISO9001
Delivery Time :
15-30 Days
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Blind and Buried Via PCB for High Density Interconnect Applications

Shenzhen Jiaqing Circuit Co., Ltd.

Verified Supplier
1 Years
shenzhen
Since 2012
Business Type :
Manufacturer
Total Annual :
20000000-50000000
Employee Number :
201~300
Certification Level :
Verified Supplier
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