| Appearance | Dimensions as per 3,4. | Visual examination or Vernier Calipers. |
| Marking | To be easily legible. | Visual examination. |
| Dielectric Strength (Between Lead wires) | No failure (150% of rated voltage for 60s). | DC voltage applied in insulating liquid or gas (Charge/discharge current: 50mA max.). |
| Body insulation | No failure (15kV for 10s). | DC voltage applied between lead wires and small metals (Charge/discharge current: 50mA max.). |
| Insulation Resistance (I.R.) | 100,000 MΩ min. | Measured with DC 1kV within 60±5s of charging. |
| Capacitance | Within specified tolerance. | Measured at 20°C with 1±0.2kHz and AC5V(r.m.s.) max. |
| Dissipation Factor (D.F.) | 0.2% max. | Same condition as capacitance measurement. |
| Temperature Characteristic (Capacitance Change) | Y5T: +22.0%~-33.0% | Capacitance measured at different temperatures (20°C, 85°C). |
| Strength of Lead Pull | Lead wire shall not cut off. Capacitor shall not be broken. | Tensile weight up to 10N applied for 10±1 s in radial direction. |
| Bending | Each lead wire shall be subjected to 5N weight and then a 90° to bend, in one direction, return to original position, and then a 90° bend in the opposite direction. | Rate of one bend in 2 to 3 s. |
| Solderability of Leads | Lead wire shall be soldered with uniformly coated on the axial direction over 3/4 of the circumferential direction. | Dipped into 25% methanol solution of rosin then molten solder of 235±5°C for 2±0.5 s. Dipping depth: 1.5 to 2.0mm from lead root. |
| Soldering Effect (Appearance) | No marked defect. | Lead wires immersed into melted solder of 350±10°C for 3.5±0.5 s. Stored for 24±2 h at room condition. |
| Soldering Effect (Capacitance Change) | Within ±10% | Measured after soldering effect test. |
| Soldering Effect (Dielectric Strength) | No failure | Measured after soldering effect test. |