| High Temperature Exposure (Storage) | IEC 60115-1 4.25.3, 1,000 hours at 155C without load | <1 5%; 1 to <332K 2%; 332K to 1M 5% |
| Temperature Cycling | AEC-Q200 REV D. Stress NO.4, -55C 30min, +125C 30min, 1,000 cycles | 1% |
| Biased Humidity | AEC-Q200 REV D. Stress NO.7, 1,000 hours at 85C and 85% RH with 10% operating power | < 10K 1.5%; 10K to <332K 2%; 332K to 1M 5% |
| Load Life | IEC 60115-1 4.25.1, Rated load, 1,000 hours (1.5h ON, 0.5h OFF, at 70C) | 3% |
| Load Life (AEC-Q200) | AEC-Q200 REV D. Stress NO.8, 1,000 hours at 125C with de-rated continuous working voltage | 5% |
| Resistance to Solvents | AEC-Q200 REV D. Stress NO.12 | No visible damage on appearance and marking |
| Mechanical Shock | AEC-Q200 REV D. Stress NO.13 (Peak value: 100 g's, Duration: 6 ms) | 0.5% |
| Vibration | AEC-Q200 REV D. Stress NO.14 (5 g's for 20 min., 10 - 2,000 Hz) | 0.5% |
| Resistance to Soldering Heat | AEC-Q200 REV D. Stress NO.15 (Dip in solder bath at 2605C for 101 sec) | 0.5% |
| Anti-sulfuration test | EIA-977 (conditions B), 750 hours at (1052)C without load | 1% / 5% |
| ESD | AEC-Q200 REV D. Stress NO.17 (Human body model, 2KV) | 0.5% |
| Solderability | AEC-Q200 REV D. Stress NO.18 (Solder area covered after (2353)C/(20.2) sec) | 95% min. coverage |
| Flammability | AEC-Q200 REV D. Stress NO.20 (UL-94) | V-0 or V-1 |
| Board Flex | AEC-Q200 REV D. Stress NO.21 | 0.5% |
| Terminal Strength | AEC-Q200 REV D. Stress NO.22 (Force of 1.8kg for 60 seconds) | 0.5% |
| Short Time Overload | IEC 60115-1 4.13 (5 seconds 2.5x rated voltage) | 0.5% |
| Climatic test | IEC 60115-1 4.23 | 1% |
| Load Life In Humidity | IEC 60115-1 4.24 (56 days rated load at (402)C and (933)% RH) | 3% |
| Single pulse high voltage overload | IEC 60115-1 4.27 (5 pulses of 1.2/50s at 10x rated voltage) | 0.75% |
| Periodic Electric Overload | IEC 60115-1 4.39 (3.9x rated voltage, 0.1s ON, 2.5s OFF for 1,000 cycles) | 1% |