Revolutionary Zero-Footprint Test Socket for LPDDR BGA200 Packages
Our ultra-low-profile test socket eliminates traditional testing hassles with its innovative direct-solder design.
Key Benefits:
- No PCB Modifications Needed - Interposer matches exact chip footprint
- Two Testing Options:
- F Series: Simple direct-contact design
- F1 Series: With test points for signal/power analysis
- High-Speed Ready: Optimized for LPDDR4/5 performance validation
- Durable Construction: 10,000+ insertion cycle lifespan
Perfect For:
- Memory manufacturers (production testing)
- Validation labs (quick device verification)
- R&D teams (prototype debugging)
The image is for reference only. All items listed below include zero-footprint sockets. Please contact us for details
| BGA254 | BGA221 | BGA153 | BGA78 | BGA200 | BGA132 |
| BGA153 | | BGA162 | BGA96 | BGA315 | BGA136 |
| | | BGA169 | | BGA152 | |
| | | BGA100 | | BGA154 | |
| | | BGA254 | | | |
F VS F1 Solution
How to: install the adapter ↔ test board.
Step 1.
Solder interposer -> test board
Step 2.
Attach test socket
Step 3.
Insert chip & lock cover