High-Performance Zero-Footprint eMMC Test Sockets for BGA162, BGA169 & BGA254 Packages
Our innovative direct-solder test sockets revolutionize eMMC memory validation with their ultra-compact, chip-size interposer design. Eliminating the need for PCB modifications, these sockets save valuable development time while ensuring superior signal integrity
Key Features & Benefits:
- Perfect chip-sized interposer matches exact BAG153/BGA100/BGA162/BGA169/BGA254 footprints
- No PCB cutouts required - simpler board layout design
- Direct solder mounting for instant testing capability
Flexible Testing Options
- Standard F Series: Simple, reliable contact solution
- Advanced F1 Series:
- Integrated test points for signal monitoring
- Power consumption analysis capabilities
- Debugging-friendly architecture
Engineering-Grade Reliability
- 10,000+ insertion cycles - exceeds industry standards
- -40 °C to +125°C operating range
- Gold-plated contacts for superior conductivity

The image is for reference only. All items listed below include zero-footprint sockets. Please contact us for details
| BGA254 | BGA221 | BGA153 | BGA78 | BGA200 | BGA132 |
| BGA153 | | BGA162 | BGA96 | BGA315 | BGA136 |
| | | BGA169 | | BGA152 | |
| | | BGA100 | | BGA154 | |
| | | BGA254 | | | |
F vs F1 Solution Comparison
Installation Steps:
- Solder interposer -> test board
- Attach test socket
- Insert chip & lock cover
