High-Performance Zero-Footprint Sockets for eMMC (BGA100 & BGA153) Testing
Our ultra-compact eMMC test sockets provide a fast, reliable testing solution with a direct-solder design --requiring no PCB modifications for hassle-free validation of embedded memory chips.
Key Features:
- Perfect Chip-Sized Interposer - Matches BGA100 & BGA153 footprints precisely
- No Need for PCB Cutouts - Solder directly onto test boards for instant use
- Two Versions for Different Testing Needs:
- F Series (Standard) - Simplified contact-only testing
- F1 Series (Enhanced) - Test points for signal and power analysis (great for debugging)
- High-Speed Compatibility - Supports fast eMMC 5.1 & UFS interface validation
- Durable & Reliable - Over 10,000 mating cycles
Ideal For:
- Manufacturers conducting production testing on eMMC chips
- R & D Teams validating board-level eMMC performance
- Repair & Debugging labs analyzing signal integrity
eMMC BGA153 eMMC BGA100
The image is for reference only. All items listed below include zero-footprint sockets. Please contact us for details
| BGA254 | BGA221 | BGA153 | BGA78 | BGA200 | BGA132 |
| BGA153 | | BGA162 | BGA96 | BGA315 | BGA136 |
| | | BGA169 | | BGA152 | |
| | | BGA100 | | BGA154 | |
| | | BGA254 | | | |
F vs F1 Solution Comparison
Installation Steps:
- Solder interposer -> test board
- Attach test socket
- Insert chip & lock cover