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High Density EMCP Test Socket For BGA221 Packages Zero Footprint
High Density EMCP Test Socket For BGA221 Packages Zero Footprint
Specifications
Brand Name :
Sireda
Model Number :
Open Top
Certification :
ISO9001
Place of Origin :
China
MOQ :
1
Price :
Get Quote
Pitch :
≥0.3mm
Pin Count :
2-2000+
Compatible Packages: :
BGA, QFN, LGA, SOP, WLCSP
Socket Type :
Open Top
Conductor Type :
Probe Pins, Pogo Pin, PCR
Description
High-Density eMCP Testing Solution for BGA221 Packages

Revolutionize your embedded memory validation with our zero-footprint BGA221 eMCP test socket. The precision-engineered interposer matches the exact chip footprint, enabling direct solder mounting without PCB modifications.

Key Advantages:
  • Instant deployment with no PCB milling requirements
  • Two configurations available:
    • F-Series: Standard contact solution
    • F1-Series: Integrated test points for signal analysis
  • Supports LPDDR+NAND stacked packages
  • Gold-plated contacts ensure > 10,000 test cycles
  • Compact 2.5mm profile ideal for dense boards
Technical Specs:
✔ BGA221 compatibility (0.5mm pitch)
✔ Supports JEDEC eMCP standards
✔ Operating temp: -40°C to +125°C
✔ Signal integrity up to 4266Mbps
Perfect for:

Memory manufacturers, smartphone repair centers, embedded system developers

High Density EMCP Test Socket For BGA221 Packages Zero Footprint High Density EMCP Test Socket For BGA221 Packages Zero Footprint

The image is for reference only. All items listed below include zero-footprint sockets. Please contact us for details

Ufs eMCP eMMC DDR LPDDR NAND
BGA254 BGA221 BGA153 BGA78 BGA200 BGA132
BGA153 BGA162 BGA96 BGA315 BGA136
BGA169 BGA152
BGA100 BGA154
BGA254
F vs F1 Solution Comparison
High Density EMCP Test Socket For BGA221 Packages Zero Footprint
Installation Steps:

Solder interposer -> test board

Attach test socket

Insert chip & lock cover

High Density EMCP Test Socket For BGA221 Packages Zero Footprint
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High Density EMCP Test Socket For BGA221 Packages Zero Footprint

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Product Detail
Brand Name :
Sireda
Model Number :
Open Top
Certification :
ISO9001
Place of Origin :
China
MOQ :
1
Price :
Get Quote
Contact Supplier
High Density EMCP Test Socket For BGA221 Packages Zero Footprint

Sireda Technology Co., Ltd.

Verified Supplier
1 Years
shenzhen
Since 2010
Business Type :
Manufacturer
Main Products :
IC Test Sockets, Test Connector, BGA Test Socket
Total Annual :
10000000-50000000
Employee Number :
101~120
Certification Level :
Verified Supplier
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