Overview
This thermally self-bondable polyurethane enameled copper wire follows 3UEW standard with excellent direct solderability, requiring no enamel stripping before soldering. It consists of polyurethane primer and fusible self-bonding top coat, featuring low dielectric loss on both layers. The wire delivers stable thermal adhesion and passes strict thermal shock and softening breakdown tests without cracking or insulation breakdown. With low springback, it supports tight winding. Its polyurethane insulation brings outstanding high-frequency performance, widely applied in miniature inductors, transformers and wireless charging coils for consumer electronics.

Specification

Product Features

Superior Direct Solderability
This wire adopts standard 2UEW polyurethane insulation with excellent direct solderability. It can be soldered directly under appropriate heating conditions without manually scraping the enamel layer, which simplifies multiple processing steps during coil winding, cuts labor costs significantly and lifts overall production efficiency for coil manufacturers.

Reliable Thermal Self-bonding Performance
It is coated with a special thermally meltable bonding top coat. After sufficient baking treatment, the adhesive layer on the wire surface melts and generates stable and strong adhesion between wire turns. It can fix the coil shape tightly to avoid loose winding and effectively reduce vibration noise generated when electronic devices work

Excellent Electrical and Thermal Resistance
Both the primer insulation layer and self-bonding top coat deliver ultra-low dielectric loss, which effectively reduces heat loss when working at high frequency. The wire can pass rigorous thermal shock tests without any cracking on the enamel film, and also withstand softening breakdown tests without insulation damage or failure

Low Springback Performance
The copper conductor undergoes standardized softening treatment to achieve minor rebound after winding. It supports tight, tidy and high-density winding on tiny bobbins, improves the slot fill rate of coils, and fully meets the miniaturization design demands of various small electronic components

Applications

Vibration Motors for Mobile Phones and Watches, Coreless Motor, Inductor Coil, Wireless Charging Receiver Coil, IC Card Coils