I.Overview
Ultra-pure water is an indispensable core component in chemical mechanical polishing (CMP) polishing solutions, with its purity directly determining the performance of the polishing solution and chip yield. In semiconductor manufacturing, CMP polishing solutions must meet nanometer-level planarization requirements, and ultra-pure water plays a critical role and meets stringent technical requirements in this application.
In CMP polishing solutions, ultra-pure water is not only a solvent but also an active component that determines polishing uniformity, defect rates, and chip reliability. An ultra-pure water system compliant with the SEMI F63-1109 standard is the cornerstone for achieving a yield rate exceeding 95% in advanced processes (7nm and below).
II.Standard Process
Municipal Tap Water → Pretreatment (Multi - media Filtration) → Activated Carbon Adsorption (Residual Chlorine Removal) → Two - stage RO → EDI (Electrodeionization) Continuous Deionization → Mixed Bed Polishing → 185/254nm UV→ 0.05μm Ultrafiltration → Degassing Membrane → Nitrogen - Sealed Storage Tank → 316L Stainless Steel Piping → CMP Slurry Production Line
III.Parameters
Parameters | Requirements | |||
Resistivity | ≥18.2 MΩ·cm (25°C) | |||
TOC | ≤1 ppb | |||
Particles | ≤5 particles/mL (≥0.05μm) | |||
Dissolved Oxygen | ≤10 ppb | |||
Metal Ions | Na⁺/K⁺ < 0.01 ppb | |||
Fe/Cu/Al < 0.005 ppb | ||||
Anions | Cl⁻/SO₄²⁻ < 0.02 ppb | |||
Microorganisms | < 0.1 CFU/mL |
IV.The core functions of ultrapure water in CMP polishing fluid
Solvent carrier
Reaction medium
Contaminant control
V.Here is a guideline for you to get a proper quotation
Tell us the raw water/source of water(tap water, well water, or sea water, etc)
Provide water analysis report(TDS , conductivity, or resistivity, etc)
Required production capacity( 5m³/H, 50m³/H,or 500m³/H, etc)
What's the pure water used for( industrial,Food and Beverage,or agriculture, etc )