HEROLASER Picosecond UV Laser Cutting Machine

Model Profile

Picosecond laser cutting machine is applicable to ultra-thin metal materials (copper, gold, silver, aluminum, titanium, nickel, stainless steel, molybdenum) Cutting, drilling and surface microstructure (texture) of flexible materials (PPC Teflon, electromagnetic film, adhesive film), graphene, carbon fiber, silicon wafer, ceramics, FPC and other materials Scribing, grooving, and micromachining of polymer materials and composites. The equipment has a wide range of uses and applicability. It can realize various treatments, customize the control depth and width, and realize the functions of stripping, etching, marking, grooving, punching, cutting, etc. on the surface of materials.

Model Features

1.Excellent beam quality, good long-term stability, negligible thermal effect.

2. The independently developed software control system can customize and upgrade various functions according to customer requirements.

3. CCD visual pre scanning & automatic target grasping and positioning processing, automatic processing of imported drawings, simple and fast operation.

4. With higher single pulse energy and higher machining accuracy, it can realize fine machining for almost any solid material.

5. It adopts picosecond ultraviolet laser and ultra short pulse ultraviolet cold laser processing,

6. No heat conduction, suitable for high-speed cutting, etching, grooving and punching of any organic-inorganic materials, with a minimum of 3 μ M and heat affected zone.

Product Advantages

1. CCD visual pre scanning & automatic target grasping and positioning, XY platform accuracy ≤± 3 μ m；

2. Precision mechanical structure, imported optical components, which can realize high stability and high precision processing;

3. The machine adopts the marble structure with strong anti-seismic performance to ensure the machine performance and overall processing accuracy;

4. Support a variety of visual positioning features, such as cross, solid circle, hollow circle, L-shaped right angle edge, and image feature points;

5. Adopted picosecond laser, ultra short pulse processing, no heat conduction, used for cutting any organic / inorganic materials.