Dual-track NGOK buffer machine, SMT PCB sorting and buffering equipment

I. Equipment Parameters
Model: OK-HCJ-250S Dual-track NGOK buffer machine
Dimensions: 1100*1450*1600mm
Conveying height: 900±30mm (suitable for SMT standard production line connection)
Compatible PCB specifications: Board width 50-250mm, maximum board length 450mm
Power supply: 220V / 0.35KW Low energy consumption
Conveying direction: freely switchable left and right
Buffer capacity: 20 PCB boards per batch
Working air pressure: 4-6 bar
Total weight: 420kg
Conveying structure: Dual-rail independent conveyor design

II. Equipment Features
1. Enclosed sheet metal + aluminum alloy integrated body, robust and stable structure, high protection level, wear-resistant and deformation-free for workshop use
2. Three modes in one machine: OK good product buffering, NG defective sorting, and production line direct flow, automatically distinguishing good and bad PCB boards
3. Standard PLC intelligent control system, stable operation without board jamming, low failure rate, stable and durable for long-term mass production
4. Supports both first-in-first-out (FIFO) and last-in-last-out (LIFO) discharge logics, adaptable to various production scheduling needs
5. High-definition touch screen human-machine interface, with automatic fault detection and prompts, dual alarm sound and light reminders, simple and easy to operate and maintain
6. Buffer lifting step distance can be adjusted according to PCB 7. Adjustable board thickness for greater versatility and compatibility with various board materials.

8. Manually adjustable width structure with a hand-cranked screw for smooth and precise adjustment, saving time and effort in track adjustment.

9. Equipped with a standard SMEMA universal interface for seamless integration into the entire automated SMT production line.

III. Application Scenarios

1. SMT Placement Production Line: Used in conjunction with placement machines and reflow soldering back-end systems to temporarily buffer processed PCB boards, balancing the production cycle of upstream and downstream equipment and preventing line congestion and downtime.

2. Semiconductor Manufacturing Processes: Used in intermediate stages such as photolithography, etching, and packaging to temporarily store wafers and chip semi-finished products, ensuring smooth and seamless transitions between processes.

3. Back-end Support for Inspection Equipment: Adapted to SPI solder paste inspection and AOI vision inspection equipment back-end systems, receiving inspection signals to automatically sort and collect defective PCB boards, achieving automatic classification and isolation of good and defective products, saving manual sorting costs.