SMT Fully Automatic Single-Rail Flipping Machine

I. Equipment Parameters
Model: OK-FBJ-460
Dimensions: 600*950*1500mm
Conveying Height: 900±30mm
Applicable Frame Dimensions: PCB board maximum width 50-460mm, PCB board maximum length 450mm
Power Supply and Load: 220V/0.35KW
Conveying Direction: Right-Left/Left-Right selectable
Air Pressure and Flow: 4-6bar
Weight: 160kg
Flipping Function: Supports 90° flipping, 180° flipping.

Conveying Track: Single-rail structure

II. Equipment Features
1. The entire machine adopts a closed sheet metal and aluminum alloy unibody molding, making the machine body sturdy and durable, dustproof and impact-resistant, and not easily deformed during long-term workshop operation.

2. Stepper motor combined with precision ball screw drive for lifting and lowering, ensuring precise and smooth positioning, and preventing vibration and damage to the PCB board surface during conveying.

3. Equipped with a mature PLC main control system, offering strong anti-interference capabilities and stable operation with few malfunctions during long-term continuous mass production.

4. High-definition touchscreen integrated control panel, simple and intuitive operation, with built-in fault self-diagnosis prompts, allowing even beginners to quickly learn how to operate it.

5. Supports 90° and 180° multi-angle free rotation, flexibly matching various process requirements for double-sided production.

6. Hand-cranked screw track adjustment design, smooth and precise width adjustment, quickly adapting to various PCB board specifications.

7. Integrated audible and visual alarms + screen pop-up prompts, timely alerts for production line abnormalities, reducing downtime and production losses.

8. Built-in standard SMEMA universal communication port, allowing seamless connection with SMT front-end and back-end equipment to form a complete automated production line.

III. Application Scenarios

1. Double-sided SMT production flipping: After single-sided PCB mounting, the board surface is automatically flipped, quickly switching between front and back side processing to achieve simultaneous mounting production of components on both sides.

2. Finished Product Electrical Testing Flip-Over: After surface mount soldering, the circuit board is flipped over for easy inspection of the back circuit solder joints by testing equipment, ensuring strict control over factory quality standards.

3. Defective Board Repair and Rework Flip-Over: Circuit boards with soldering defects or component failures are automatically flipped over, facilitating the inspection and replacement of back-side components by operators, improving rework efficiency.

4. Bottom Sealing and Sealing Flip-Over: A dedicated flip-over for bottom sealing and dispensing processes on PCBs, ensuring the adhesive cures naturally and evenly, preventing dripping that could affect the finished product's appearance and performance.

5. Flexible Integration for Small and Medium-Sized Production Lines: Suitable for various small and medium-sized electronic processing plants, it can be freely combined with loading, unloading, buffering, and screening equipment to form a complete production line.